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BAL-2690D3U Datasheet(PDF) 6 Page - STMicroelectronics |
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BAL-2690D3U Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 8 page Package information BAL-2690D3U 6/8 Doc ID 16056 Rev 2 Figure 14. Flip-Chip - tape and reel specification Note: More packing information is available in the applications note: AN 2348: “Flip-Chip: package description and recommendations for use” Figure 12. Footprint Figure 13. Marking Copper pad diameter: 220 µm recommended Solder mask opening 300 µm minimum Solder stencil opening: 220 µm recommended x y x w z w Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) ECOPACK® Grade User direction of unreeling All dimensions in mm 4.0 ± 0.1 2.0 ± 0.05 2.0 ± 0.05 Ø 1.50 ± 0.10 0.73± 0.05 0.20 ± 0.015 1.0 ± 0.05 Dot identifying pin A1 location |
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