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CXK5T8257BYM-10LLX Datasheet(PDF) 9 Page - Sony Corporation |
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CXK5T8257BYM-10LLX Datasheet(HTML) 9 Page - Sony Corporation |
9 / 10 page – 9 – CXK5T8257BTM/BYM/BM Package Outline Unit: mm CXK5T8257BTM CXK5T8257BYM SONY CODE EIAJ CODE JEDEC CODE PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER PLATING COPPER / 42 ALLOY 28PIN TSOP (Plastic) ∗8.0 ± 0.1 0.55 ± 0.1 1.2 MAX 0° to 10° 0.2 – 0.05 + 0.1 0.05 – 0.05 + 0.1 0.127 – 0.02 + 0.07 A 7 1 28 22 8 21 TSOP-28P-L01 TSOP028-P-0000-A 0.1 DETAIL A 0.2g NOTE: Dimension “ ∗” does not include mold protrusion. SONY CODE EIAJ CODE JEDEC CODE PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER PLATING COPPER / 42 ALLOY 28PIN TSOP (Plastic) ∗8.0 ± 0.1 0.55 ± 0.1 1.2 MAX 0.2 – 0.05 + 0.1 0.05 – 0.05 + 0.1 0.127 – 0.02 + 0.07 A 22 28 1 7 21 8 TSOP-28P-L01R TSOP028-P-0000-B 0.1 0° to 10° DETAIL A 0.2g NOTE: Dimension “ ∗” does not include mold protrusion. |
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