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Electronic Components Datasheet Search |
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CXK5V81000ATM Datasheet(PDF) 10 Page - Sony Corporation |
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CXK5V81000ATM Datasheet(HTML) 10 Page - Sony Corporation |
10 / 10 page ![]() – 10 – CXK5V81000ATM Package Outline Unit: mm SONY CODE EIAJ CODE JEDEC CODE TSOP-32P-L01 TSOP032-P-0820-A PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT 42 ALLOY SOLDER PLATING EPOXY / PHENOL RESIN 0° to 10° 32PIN TSOP (I) (PLASTIC) 8.0 ± 0.2 32 17 0.2 – 0.03 + 0.08 0.5 NOTE : ∗NOT INCLUDE MOLD FINS. 116 A 0.127 – 0.02 + 0.05 0.1 ± 0.1 1.07 – 0.1 + 0.2 DETAIL A 0.1 0.08 M |