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CXK5T81000AM-10LLX Datasheet(PDF) 10 Page - Sony Corporation |
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CXK5T81000AM-10LLX Datasheet(HTML) 10 Page - Sony Corporation |
10 / 11 page ![]() Package Outline Unit: mm CXK5T81000ATM – 10 – CXK5T81000ATM/AYM/AM CXK5T81000AYM SONY CODE EIAJ CODE JEDEC CODE TSOP-32P-L01 TSOP032-P-0820 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT 42 ALLOY SOLDER PLATING EPOXY RESIN 32PIN TSOP (PLASTIC) M 0.08 0.5 0.2 – 0.03 + 0.08 16 1 17 32 8.0 ± 0.2 1.07 – 0.1 + 0.2 0.127 – 0.02 + 0.05 0.1 ± 0.1 0° to 10° A 0.1 DETAIL A NOTE : “ ∗” Dimensions do not include mold protrusion. 0.3g SONY CODE EIAJ CODE JEDEC CODE PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER PLATING 42 ALLOY TSOP-32P-L01R TSOP032-P-0820-B 32PIN TSOP (PLASTIC) M 0.08 0.5 0.2 – 0.03 + 0.08 16 1 17 32 8.0 ± 0.2 1.07 – 0.1 + 0.2 0.127 – 0.02 + 0.05 0.1 ± 0.1 0° to 10° A 0.1 DETAIL A 0.3g NOTE: Dimension “ ∗” does not include mold protrusion. |
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