 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
STPS40L45C-Y Datasheet(PDF) 4 Page - STMicroelectronics |
|
||||||||||||||||||||||||||||||
STPS40L45C-Y Datasheet(HTML) 4 Page - STMicroelectronics |
|
|
4 / 7 page 
Characteristics STPS40L45C-Y 4/7 Doc ID 023224 Rev 1 Figure 7. Reverse leakage current versus reverse voltage applied (typical values, per diode) Figure 8. Junction capacitance versus reverse voltage applied (typical values, per diode) 0 5 10 15 20 25 30 35 40 45 1E-2 1E-1 1E+0 1E+1 1E+2 1E+3 IR(mA) Tj = 150 °C Tj = 125 °C Tj = 75 °C Tj = 25 °C VR(V) 1 10 100 0.1 1.0 10.0 C(nF) F=1MHz Tj=25°C VR(V) Figure 9. Forward voltage drop versus forward current (maximum values, per diode) Figure 10. Thermal resistance junction to ambient versus copper surface under tab. 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1 10 100 1000 VFM(V) IFM(A) Typical values Tj=150°C Tj=125°C Tj=75°C Tj=25°C 0 10 20 30 40 50 60 70 80 0 5 10 15 20 25 30 35 40 S(Cu)(cm²) R (°C/W) th(j-a) epoxy printed board FR4, copper thickness = 35 µm |
|
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
