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Electronic Components Datasheet Search |
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CXK5T16100TM- Datasheet(PDF) 10 Page - Sony Corporation |
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CXK5T16100TM- Datasheet(HTML) 10 Page - Sony Corporation |
10 / 10 page ![]() – 10 – CXK5T16100TM Package Outline Unit : mm SONY CODE EIAJ CODE JEDEC CODE M PACKAGE STRUCTURE MOLDING COMPOUND LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY / PHENOL RESIN SOLDER PLATING 42 ALLOY 44PIN TSOP (II) (PLASTIC) 400mil ∗18.41 ± 0.1 0.8 0.3 ± 0.1 122 23 44 0.125 – 0.02 + 0.05 A 1.2 MAX 0.1 0.13 B 0.32 ± 0.08 (0.3) 0° to 10° 0.1 – 0.05 + 0.1 TSOP (II) -44P-L01 TSOP (II) 044-P-0400-A DETAIL A B DETAIL 0.5g NOTE: Dimension “ ∗” does not include mold protrusion. |