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CXG1077TN Datasheet(PDF) 4 Page - Sony Corporation |
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CXG1077TN Datasheet(HTML) 4 Page - Sony Corporation |
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4 / 4 page  SONY CODE EIAJ CODE JEDEC CODE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY PACKAGE STRUCTURE 0.22 – 0.07 0.5 5 1.2MAX ∗2.8 ± 0.1 10 6 0.1 – 0.05 + 0.15 0° to 10° 1 A (0.2) 0.22 – 0.07 + 0.08 DETAIL A 0.02g TSSOP-10P-L01 10PIN TSSOP(PLASTIC) 0.1 0.1 M NOTE: Dimension “ ∗” does not include mold protrusion. 0.25 + 0.08 Package Outline Unit : mm CXG1077TN —4— |
Similar Part No. - CXG1077TN |
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Similar Description - CXG1077TN |
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