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ASB Inc. · sales@asb.co.kr · Tel: +82-42-528-7223

February 2010

ASX521

250-3000 MHz MMIC Amplifier

Pin No.

Function

Pin No.

Function.

1

2nd stage RF IN

5

GND

2

1st stage RF OUT

6

2nd stage RF OUT

3

GND

7

2nd stage RF OUT

4

1st stage RF IN

8

GND

Mounting Recommendation (in mm)

Outline Drawing

Note: 1. Backside metal paddle is RF and DC ground.

Symbols

Dimensions (In mm)

MIN

NOM

MAX

A

1.40

1.50

1.60

A1

0.00

---

0.10

A2

---

1.45

---

B

0.33

---

0.51

C

0.19

---

0.25

D

4.80

---

5.00

D2

3.20

3.30

3.40

E

5.80

6.00

6.20

E1

3.80

3.90

4.00

E2

2.30

2.40

2.50

e

---

1.27

---

L

0.40

---

1.27

y

---

---

0.10

q

0°

---

8°

|L1-L1’|

---

---

0.12

L1

1.04REF

●

Part No.

ESD Classification

HBM

Class 1B

Voltage Level: 500 V~1000 V

MM

Class A

Voltage Level: <200 V

CAUTION: ESD-sensitive device!

Moisture Sensitivity Level (MSL)

Level 3 at 260°C reflow

Note: 1. Add as much copper as possible to inner and outer layers near

the part to ensure optimal thermal performance.

2. To ensure reliable operation, device ground paddle-to-ground

pad soldering is critical.

3. Add mounting screws near the part to fasten the board to a heat

sinker. Ensure that the ground / thermal via region contacts the

heat sinker.

4. A proper heat dissipation path underneath the area of the PCB

for the mounted device is strictly required for proper thermal op-

eration. Damage to the device can result from inappropriate heat

dissipation.