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SPC5673FF3MVR3 Datasheet(PDF) 2 Page - Freescale Semiconductor, Inc |
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SPC5673FF3MVR3 Datasheet(HTML) 2 Page - Freescale Semiconductor, Inc |
2 / 133 page MPC5674F Microcontroller Data Sheet, Rev. 9 Freescale Semiconductor 2 Table of Contents 1 Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 1.1 Orderable Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 1.2 MPC567xF Family Differences . . . . . . . . . . . . . . . . . . . .4 2 MPC5674F Blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 2.1 Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 3 Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 3.1 324-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . . .6 3.2 416-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . . .9 3.3 516-ball TEPBGA Pin Assignments . . . . . . . . . . . . . . .14 3.4 Signal Properties and Muxing . . . . . . . . . . . . . . . . . . . .19 4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 4.1 Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 4.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . .21 4.2.1 General Notes for Specifications at Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . .23 4.3 EMI (Electromagnetic Interference) Characteristics . . .24 4.4 ESD Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .25 4.5 PMC/POR/LVI Electrical Specifications . . . . . . . . . . . .25 4.6 Power Up/Down Sequencing . . . . . . . . . . . . . . . . . . . .29 4.6.1 Power-Up. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29 4.6.2 Power-Down . . . . . . . . . . . . . . . . . . . . . . . . . . .30 4.6.3 Power Sequencing and POR Dependent on VDDA 30 4.7 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . .30 4.7.1 I/O Pad Current Specifications . . . . . . . . . . . . .33 4.7.2 LVDS Pad Specifications . . . . . . . . . . . . . . . . . .35 4.8 Oscillator and FMPLL Electrical Characteristics . . . . . 35 4.9 eQADC Electrical Characteristics . . . . . . . . . . . . . . . . 37 4.9.1 ADC Internal Resource Measurements . . . . . . 39 4.10 C90 Flash Memory Electrical Characteristics . . . . . . . 40 4.11 AC Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 4.11.1 Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42 4.11.2 Pad AC Specifications . . . . . . . . . . . . . . . . . . . 44 4.12 AC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45 4.12.1 Generic Timing Diagrams. . . . . . . . . . . . . . . . . 45 4.12.2 Reset and Configuration Pin Timing. . . . . . . . . 46 4.12.3 IEEE 1149.1 Interface Timing. . . . . . . . . . . . . . 47 4.12.4 Nexus Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 50 4.12.5 External Bus Interface (EBI) Timing . . . . . . . . . 53 4.12.6 External Interrupt Timing (IRQ Pin) . . . . . . . . . 57 4.12.7 eTPU Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 57 4.12.8 eMIOS Timing . . . . . . . . . . . . . . . . . . . . . . . . . 58 4.12.9 DSPI Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . 59 5 Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 5.1 324-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 5.2 416-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 5.3 516-Pin Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 6 Product Documentation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Appendix ASignal Properties and Muxing . . . . . . . . . . . . . . . . . . 73 Appendix BRevision History . . . . . . . . . . . . . . . . . . . . . . . . . . . 127 |
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