NCV7441

http://onsemi.com

10

PACKAGE DIMENSIONS

SOIC−14 NB

CASE 751A−03

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF AT

MAXIMUM MATERIAL CONDITION.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD PROTRUSIONS.

5. MAXIMUM MOLD PROTRUSION 0.15 PER

SIDE.

H

14

8

7

1

M

0.25

C

h

X 45

SEATING

PLANE

A1

A

M

_

S

A

M

0.25

C

b

13X

B

A

E

D

e

DETAIL A

L

A3

DETAIL A

DIM

MIN

MAX

MIN

MAX

INCHES

MILLIMETERS

D

8.55

8.75

0.337

0.344

E

3.80

4.00

0.150

0.157

A

1.35

1.75

0.054

0.068

b

0.35

0.49

0.014

0.019

L

0.40

1.25

0.016

0.049

e

1.27 BSC

0.050 BSC

A3

0.19

0.25

0.008

0.010

A1

0.10

0.25

0.004

0.010

M

0

7

0

7

H

5.80

6.20

0.228

0.244

h

0.25

0.50

0.010

0.019

__

_

_

6.50

14X

0.58

14X

1.18

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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