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DTC115EET1G Datasheet(PDF) 1 Page - ON Semiconductor

Part # DTC115EET1G
Description  Bias Resistor Transistor NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2012
May, 2012 − Rev. 12
1
Publication Order Number:
DTC114EET1/D
DTC114EET1 Series,
SDTC114EET1 Series
Bias Resistor Transistor
NPN Silicon Surface Mount Transistor
with Monolithic Bias Resistor Network
This new series of digital transistors is designed to replace a single
device and its external resistor bias network. The BRT (Bias Resistor
Transistor) contains a single transistor with a monolithic bias network
consisting of two resistors; a series base resistor and a base−emitter
resistor. The BRT eliminates these individual components by
integrating them into a single device. The use of a BRT can reduce
both system cost and board space. The device is housed in the
SC−75/SOT−416 package which is designed for low power surface
mount applications.
Features
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
The SC−75/SOT−416 Package Can be Soldered Using Wave or
Reflow
The Modified Gull−Winged Leads Absorb Thermal Stress During
Soldering Eliminating the Possibility of Damage to the Die
Pb−Free Packages are Available
S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Collector-Base Voltage
VCBO
50
Vdc
Collector-Emitter Voltage
VCEO
50
Vdc
Collector Current
IC
100
mAdc
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Unit
Total Device Dissipation,
FR−4 Board (Note 1) @ TA = 25°C
Derate above 25°C
PD
200
1.6
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient (Note 1)
RqJA
600
°C/W
Total Device Dissipation,
FR−4 Board (Note 2) @ TA = 25°C
Derate above 25°C
PD
300
2.4
mW
mW/°C
Thermal Resistance,
Junction−to−Ambient (Note 2)
RqJA
400
°C/W
Junction and Storage Temperature
Range
TJ, Tstg −55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0 × 1.0 Inch Pad
NPN SILICON
BIAS RESISTOR TRANSISTORS
PIN 3
COLLECTOR
(OUTPUT)
PIN 2
EMITTER
(GROUND)
PIN 1
BASE
(INPUT)
R1
R2
See detailed ordering, marking, and shipping information in
the package dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
http://onsemi.com
SC−75 (SOT−416)
CASE 463
STYLE 1
3
2
1
MARKING DIAGRAM
xx M G
G
xx
= Specific Device Code
xx = (Refer to page 2)
M
= Date Code*
G
=Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.


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