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DTC115EET1G Datasheet(PDF) 1 Page - ON Semiconductor |
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DTC115EET1G Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 13 page © Semiconductor Components Industries, LLC, 2012 May, 2012 − Rev. 12 1 Publication Order Number: DTC114EET1/D DTC114EET1 Series, SDTC114EET1 Series Bias Resistor Transistor NPN Silicon Surface Mount Transistor with Monolithic Bias Resistor Network This new series of digital transistors is designed to replace a single device and its external resistor bias network. The BRT (Bias Resistor Transistor) contains a single transistor with a monolithic bias network consisting of two resistors; a series base resistor and a base−emitter resistor. The BRT eliminates these individual components by integrating them into a single device. The use of a BRT can reduce both system cost and board space. The device is housed in the SC−75/SOT−416 package which is designed for low power surface mount applications. Features • Simplifies Circuit Design • Reduces Board Space • Reduces Component Count • The SC−75/SOT−416 Package Can be Soldered Using Wave or Reflow • The Modified Gull−Winged Leads Absorb Thermal Stress During Soldering Eliminating the Possibility of Damage to the Die • Pb−Free Packages are Available • S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Symbol Value Unit Collector-Base Voltage VCBO 50 Vdc Collector-Emitter Voltage VCEO 50 Vdc Collector Current IC 100 mAdc THERMAL CHARACTERISTICS Rating Symbol Value Unit Total Device Dissipation, FR−4 Board (Note 1) @ TA = 25°C Derate above 25°C PD 200 1.6 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 1) RqJA 600 °C/W Total Device Dissipation, FR−4 Board (Note 2) @ TA = 25°C Derate above 25°C PD 300 2.4 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 2) RqJA 400 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR−4 @ Minimum Pad 2. FR−4 @ 1.0 × 1.0 Inch Pad NPN SILICON BIAS RESISTOR TRANSISTORS PIN 3 COLLECTOR (OUTPUT) PIN 2 EMITTER (GROUND) PIN 1 BASE (INPUT) R1 R2 See detailed ordering, marking, and shipping information in the package dimensions section on page 2 of this data sheet. ORDERING INFORMATION http://onsemi.com SC−75 (SOT−416) CASE 463 STYLE 1 3 2 1 MARKING DIAGRAM xx M G G xx = Specific Device Code xx = (Refer to page 2) M = Date Code* G =Pb−Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. |
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