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NTD5805NT4G Datasheet(PDF) 2 Page - ON Semiconductor

Part # NTD5805NT4G
Description  Power MOSFET 40 V, 51 A, Single N.Channel, DPAK
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NTD5805NT4G Datasheet(HTML) 2 Page - ON Semiconductor

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NTD5805N, NVD5805N
http://onsemi.com
2
ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise noted)
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain−to−Source Breakdown Voltage
V(BR)DSS
VGS = 0 V, ID = 250 mA
40
V
Drain−to−Source Breakdown Voltage
Temperature Coefficient
V(BR)DSS/TJ
40.8
mV/°C
Zero Gate Voltage Drain Current
IDSS
VGS = 0 V,
VDS = 40 V
TJ = 25°C
1.0
mA
TJ = 150°C
100
Gate−to−Source Leakage Current
IGSS
VDS = 0 V, VGS = ±20 V
±100
nA
ON CHARACTERISTICS (Note 2)
Gate Threshold Voltage
VGS(TH)
VGS = VDS, ID = 250 mA
1.5
3.5
V
Negative Threshold Temperature
Coefficient
VGS(TH)/TJ
7.04
mV/°C
Drain−to−Source On Resistance
RDS(on)
VGS = 10 V, ID = 15 A
7.6
9.5
mW
VGS = 5.0 V, ID = 10 A
10.9
16
Forward Transconductance
gFS
VDS = 15 V, ID = 15 A
8.54
S
CHARGES, CAPACITANCES AND GATE RESISTANCES
Input Capacitance
Ciss
VGS = 0 V, f = 1.0 MHz,
VDS = 25 V
1725
pF
Output Capacitance
Coss
220
Reverse Transfer Capacitance
Crss
160
Total Gate Charge
QG(TOT)
VGS = 10 V, VDS = 32 V,
ID = 30 A
33
80
nC
Threshold Gate Charge
QG(TH)
2.0
Gate−to−Source Charge
QGS
7.2
Gate−to−Drain Charge
QGD
9.8
SWITCHING CHARACTERISTICS (Note 3)
Turn−On Delay Time
td(on)
VGS = 10 V, VDD = 32 V,
ID = 30 A, RG = 2.5 W
10.2
ns
Rise Time
tr
17.9
Turn−Off Delay Time
td(off)
22.9
Fall Time
tf
4.5
DRAIN−SOURCE DIODE CHARACTERISTICS
Forward Diode Voltage
VSD
VGS = 0 V,
IS = 10 A
TJ = 25°C
0.83
1.2
V
TJ = 150°C
0.65
Reverse Recovery Time
tRR
VGS = 0 V, dIs/dt = 100 A/ms,
IS = 30 A
24.8
ns
Charge Time
ta
14.6
Discharge Time
tb
10.2
Reverse Recovery Charge
QRR
15.5
nC
2. Pulse Test: Pulse Width ≤ 300 ms, Duty Cycle ≤ 2%.
3. Switching characteristics are independent of operating junction temperatures.


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