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MC7809ACTG Datasheet(PDF) 22 Page - ON Semiconductor |
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MC7809ACTG Datasheet(HTML) 22 Page - ON Semiconductor |
22 / 34 page MC7800, MC7800A, MC7800AE, NCV7800 http://onsemi.com 22 Figure 13. Worst Case Power Dissipation versus Ambient Temperature (Case 221A) Figure 14. Input Output Differential as a Function of Junction Temperature (MC78XXC, AC, B) 20 16 12 8.0 4.0 0 -50 -25 025 5075 100 125 150 TA, AMBIENT TEMPERATURE (°C) qHS = 0°C/W 0.5 0 -75 -50 -25 0 25 50 75 100 125 TJ, JUNCTION TEMPERATURE (°C) IO = 0 mA IO = 20 mA IO = 1.0 A IO = 500 mA IO = 200 mA DVO = 2% of VO - - - Extended Curve for MC78XXB qJC = 5°C/W qJA = 65°C/W TJ(max) = 150°C qHS = 5°C/W qHS = 15°C/W No Heatsink 2.0 1.5 1.0 2.5 Figure 15. D2PAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length 30 40 50 60 70 80 1.0 1.5 2.0 2.5 3.0 3.5 010 20 30 25 15 5.0 L, LENGTH OF COPPER (mm) PD(max) for TA = 50°C Minimum Size Pad 2.0 oz. Copper L L Free Air Mounted Vertically RqJA 40 50 60 70 80 90 100 0 0.4 0.8 1.2 1.6 2.0 2.4 010 20 30 25 15 5.0 L, LENGTH OF COPPER (mm) PD(max) for TA = 50°C Minimum Size Pad L L Free Air Mounted Vertically RqJA 2.0 oz. Copper Figure 16. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length |
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