CS8363

http://onsemi.com

7

PACKAGE DIMENSIONS

DPS SUFFIX

CASE 936AB−01

ISSUE B

0.539

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

E

0.380

0.420

9.65

10.67

D

0.325

0.368

8.25

9.53

A

0.170

0.180

4.32

4.57

b

0.026

0.036

0.66

0.91

c2

0.045

0.055

1.14

1.40

e

0.050 BSC

1.27 BSC

H

0.579

13.69

14.71

L1

A1

0.000

0.010

0.00

0.25

c

0.017

0.026

0.43

0.66

E

D

L1

c2

c

b

e

E1

D1

H

−−−

0.066

−−−

1.68

L

0.058

0.078

1.47

1.98

M

L3

0.010 BSC

0.25 BSC

0

8

°°

0

8

°°

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

NOTES:

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. CONTROLLING DIMENSION: INCHES.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH AND GATE PROTRUSIONS. MOLD FLASH

AND GATE PROTRUSIONS NOT TO EXCEED

0.005 MAXIMUM PER SIDE. THESE DIMENSIONS

TO BE MEASURED AT DATUM H.

4. THERMAL PAD CONTOUR OPTIONAL WITHIN

DIMENSIONS E, L1, D1, AND E1. DIMENSIONS

D1 AND E1 ESTABLISH A MINIMUM MOUNTING

SURFACE FOR THE THERMAL PAD.

D1

0.270

−−−

6.86

−−−

E1

0.245

−−−

6.22

−−−

A

DIMENSIONS: MILLIMETERS

0.424

7X

0.584

0.310

0.136

0.040

0.050

PITCH

SOLDERING FOOTPRINT*

A1

L3

B

H

L

M

DETAIL C

SEATING

PLANE

GAUGE

PLANE

A

7X

M

A

M

0.13

B

E/2

PLANE

A

A

DETAIL C

VIEW A−A

M

A

M

0.10

B

PACKAGE THERMAL DATA

Parameter

Unit

Typical

3.5

°C/W

Typical

10−50*

°C/W