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SN74HC139-Q1 Datasheet(PDF) 1 Page - Texas Instruments |
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SN74HC139-Q1 Datasheet(HTML) 1 Page - Texas Instruments |
1 / 9 page SN74HC139-Q1 DUAL 2-LINE TO 4-LINE DECODER/DEMULTIPLEXER SCLS598B − NOVEMBER 2004 – REVISED APRIL 2008 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Qualified for Automotive Applications D Targeted Specifically for High-Speed Memory Decoders and Data-Transmission Systems D Wide Operating Voltage Range of 2 V to 6 V D Outputs Can Drive up to Ten LSTTL Loads D Low Power Consumption, 80-µA Max I CC D Typical t pd = 10 ns D ±4-mA Output Drive at 5 V D Low Input Current of 1 µA Max D Incorporate Two Enable Inputs to Simplify Cascading and/or Data Reception D ESD Protection Level per AEC-Q100 Classification − 2000-V (H2) Human-Body Model − 200-V (M3) Machine Model − 1000-V (C5) Charged-Device Model description/ordering information The SN74HC139 device is designed for high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, this decoder can minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay time of this decoder and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoder is negligible. The SN74HC139 device comprises two individual 2-line to 4-line decoders in a single package. The active-low enable (G) input can be used as a data line in demultiplexing applications. This decoder/demultiplexer features fully buffered inputs, each of which represents only one normalized load to its driving circuit. ORDERING INFORMATION{ TA PACKAGE‡ ORDERABLE PART NUMBER TOP-SIDE MARKING 40 °C to 125°C SOIC − D Reel of 2500 SN74HC139QDRQ1 HC139Q −40 °C to 125°C TSSOP − PW Reel of 2000 SN74HC139QPWRQ1 HC139Q † For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at http://www.ti.com. ‡ Package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. FUNCTION TABLE INPUTS OUTPUTS G SELECT OUTPUTS G B A Y0 Y1 Y2 Y3 H X X H H H H L L LL HH H L L HH LH H L H LH HLH L H H H H H L Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 1G 1A 1B 1Y0 1Y1 1Y2 1Y3 GND VCC 2G 2A 2B 2Y0 2Y1 2Y2 2Y3 D OR PW PACKAGE (TOP VIEW) Copyright 2008, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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