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TM2SN64EPH Datasheet(PDF) 8 Page - Texas Instruments

Part # TM2SN64EPH
Description  SYNCHRONOUS DYNAMIC RAM MODULES
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TM2SN64EPH Datasheet(HTML) 8 Page - Texas Instruments

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TM2SN64EPH 2097152 BY 64BIT
TM4SN64EPH 4194304 BY 64BIT
SYNCHRONOUS DYNAMIC RAM MODULES
SMMS706A − MARCH 1998 − REVISED APRIL 1998
8
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251−1443
ac timing requirements
’xSN64EPH-10
UNIT
MIN
MAX
UNIT
tCK2
Cycle time, CLK, CAS latency = 2
15
ns
tCK3
Cycle time, CLK, CAS latency = 3
10
ns
tCH
Pulse duration, CLK high
3
ns
tCL
Pulse duration, CLK low
3
ns
tAC2
Access time, CLK high to data out, CAS latency = 2 (see Note 8)
7.5
ns
tAC3
Access time, CLK high to data out, CAS latency = 3 (see Note 8)
7.5
ns
tOH
Hold time, CLK high to data out
3
ns
tLZ
Delay time, CLK high to DQ in low-impedance state (see Note 9)
2
ns
tHZ
Delay time, CLK high to DQ in high-impedance state (see Note 10)
8
ns
tIS
Setup time, address, control, and data input
2
ns
tIH
Hold time, address, control, and data input
1
ns
tCESP Power-down/self-refresh exit time
10
ns
tRAS
Delay time, ACTV command to DEAC or DCAB command
50
100 000
ns
tRC
Delay time, ACTV, REFR, or SLFR exit to ACTV, MRS, REFR, or SLFR command
80
ns
tRCD
Delay time, ACTV command to READ, READ-P, WRT, or WRT-P command (see Note 11)
20
ns
tRP
Delay time, DEAC or DCAB command to ACTV, MRS, REFR, or SLFR command
30
ns
tRRD
Delay time, ACTV command in one bank to ACTV command in the other bank
30
ns
tRSA
Delay time, MRS command to ACTV, MRS, REFR, or SLFR command
20
ns
tAPR
Final data out of READ-P operation to ACTV, MRS, SLFR, or REFR command
tRP − (CL −1) * tCK
ns
tAPW
Final data in of WRT-P operation to ACTV, MRS, SLFR, or REFR command
tRP + tCK
ns
tT
Transition time (see Note 12)
1
5
ns
tREF
Refresh interval
64
ms
nCCD
Delay time, READ or WRT command to an interrupting command
1
cycle
nCDD
Delay time, CS low or high to input enabled or inhibited
0
0
cycle
nCLE
Delay time, CKE high or low to CLK enabled or disabled
1
1
cycle
nCWL
Delay time, final data in of WRT operation to READ, READ-P, WRT, WRT-P
1
cycle
nDID
Delay time, ENBL or MASK command to enabled or masked data in
0
0
cycle
nDOD
Delay time, ENBL or MASK command to enabled or masked data out
2
2
cycle
nHZP2 Delay time, DEAC or DCAB command to DQ in high-impedance state, CAS latency = 2
2
cycle
nHZP3 Delay time, DEAC or DCAB command to DQ in high-impedance state, CAS latency = 3
3
cycle
nWCD Delay time, WRT command to first data in
0
0
cycle
nWR
Delay time, final data in of WRT operation to DEAC or DCAB command
1
cycle
† All references are made to the rising transition of CK unless otherwise noted.
NOTES:
8. tAC is referenced from the rising transition of CK that precedes the data-out cycle. For example, the first data out tAC is referenced
from the rising transition of CK that is CAS latency − one cycle after the READ command. Access time is measured at output
reference level 1.4 V.
9. tLZ is measured from the rising transition of CK that is CAS latency − one cycle after the READ command.
10. tHZ MAX defines the time at which the outputs are no longer driven and is not referenced to output voltage levels.
11. For read or write operations with automatic deactivate, tRCD must be set to satisfy minimum tRAS.
12. Transition time, tT, is measured between VIH and VIL.


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