SN74LVC157AEP

QUADRUPLE 2LINE TO 1LINE DATA SELECTOR/MULTIPLEXER

SCAS735A − NOVEMBER 2003 − REVISED MAY 2004

1

POST OFFICE BOX 655303

− One Assembly/Test Site, One Fabrication

Site

−40

°C to 125°C

Sources (DMS) Support

MIL-STD-883, Method 3015; Exceeds 200 V

Using Machine Model (C = 200 pF, R = 0)

† Component qualification in accordance with JEDEC and industry

standards to ensure reliable operation over an extended

temperature range. This includes, but is not limited to, Highly

Accelerated Stress Test (HAST) or biased 85/85, temperature

cycle, autoclave or unbiased HAST, electromigration, bond

intermetallic life, and mold compound life. Such qualification

testing should not be viewed as justifying use of this component

beyond specified performance and environmental limits.

description/ordering information

operation.

This device features a common strobe (G) input. When G is high, all outputs are low. When G is low, a 4-bit word

is selected from one of two sources and is routed to the four outputs. The device provides true data.

Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of this device as a translator

in a mixed 3.3-V/5-V system environment.

ORDERING INFORMATION

TA

PACKAGE‡

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

−40

°C to 125°C

SOIC − D

Tape and reel

SN74LVC157AQDREP

C157AEP

−40

°C to 125°C

TSSOP − PW

Tape and reel

SN74LVC157AQPWREP

C157AEP

‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

FUNCTION TABLE

INPUTS

OUTPUT

G

A/B

A

B

OUTPUT

Y

H

X

X

X

L

L

LL

X

L

L

LH

X

H

L

HX

L

L

L

H

X

H

H

Copyright

 2004, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

D OR PW PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

A /B

1A

1B

1Y

2A

2B

2Y

GND

G

4A

4B

4Y

3A

3B

3Y