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TWL1200IPFBRQ1 Datasheet(PDF) 2 Page - Texas Instruments |
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TWL1200IPFBRQ1 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 32 page TWL1200-Q1 SCES832A – MARCH 2012 – REVISED MARCH 2012 www.ti.com DESCRIPTION The TWL1200-Q1 is a 19-bit voltage translator specifically designed to bridge seamlessly the 1.8-V/2.6-V digital- switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). The device is optimized for SDIO, UART, and audio functions. The TWL1200-Q1 has two supply-voltage pins, VCCA and VCCB, that can be operated over the full range of 1.1 V to 3.6 V. The TWL1200-Q1 enables system designers easily to interface applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards. The TWL1200-Q1 is offered in a thin quad flat pack [TQFP (PFB)] package. Low static power consumption and small package size make the TWL1200-Q1 an ideal choice for mobile-phone applications. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) ORDERABLE TA PACKAGE(2) TOP-SIDE MARKING PART NUMBER –40°C to 85°C TQFP – PFB Tape and reel TWL1200IPFBRQ1 TWL1200Q1 (1) For the most-current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. TERMINAL FUNCTIONS TERMINAL TYPE DESCRIPTION NAME NO. AUD_CLK_A 45 I/O Connected to baseband audio subsystem; drive strength = 4 mA AUDIO_CLK_B 41 I/O Connected to Wi-Link-6 PCM subsystem; drive strength = 4 mA AUD_DIR 43 I Direction control signal for AUDIO_CLK and AUDIO_F-SYNC signals AUDIO_F_SYNK_A 46 I/O Connected to baseband audio subsystem; drive strength = 4 mA AUDIO_F_SYNK_B 40 I/O Connected to Wi-Link-6 PCM subsystem; drive strength = 4 mA AUDIO_IN_A 16 I Connected to baseband audio subsystem AUD_IN_B 22 O Connected to Wi-Link-6 PCM subsystem; drive strength = 4 mA BT_EN_A 10 I Connected to baseband UART subsystem BT_EN_B 28 O Connected to BT UART subsystem of Wi-Link-6; drive strength = 2 mA BT_UART_CTS_A 11 I Connected to baseband UART subsystem BT_UART_CTS_B 27 O Connected to BT UART subsystem of Wi-Link-6; drive strength = 4 mA BT_UART_RTS_A 12 O Connected to baseband UART subsystem; drive strength = 4 mA BT_UART_RTS_B 24 I Connected to BT UART subsystem of Wi-Link-6 BT_UART_RX_A 13 I Connected to baseband UART subsystem BT_UART_RX_B 25 O Connected to BT UART subsystem of Wi-Link-6; drive strength = 8 mA BT_UART_TX_A 15 O Connected to baseband UART subsystem; drive strength = 8 mA BT_UART_TX_B 23 I Connected to BT UART subsystem of Wi-Link-6 CLK_REQ_A 9 O Connected to baseband SDIO controller; drive strength = 4 mA CLK_REQ_B 29 I Connected to SD/SDIO peripheral 8, 14, Ground GND 20, 26 OE 42 I Output enable (active low) PCM_AUDIO_OUT_A 17 O Connected to baseband audio subsystem; drive strength = 4 mA PCM_AUD_OUT_B 21 I Connected to Wi-Link-6 PCM subsystem SDIO_CLK_A 1 I Clock signal connected to baseband SDIO controller. Referenced to VCCA Clock signal connected to SD/SDIO peripheral. Referenced to VCCB; drive strength = 8 SDIO_CLK_B 37 O mA 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): TWL1200-Q1 |
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