TWL1200-Q1

SCES832A – MARCH 2012 – REVISED MARCH 2012

www.ti.com

DESCRIPTION

The TWL1200-Q1 is a 19-bit voltage translator specifically designed to bridge seamlessly the 1.8-V/2.6-V digital-

switching compatibility gap between 2.6-V baseband and the TI Wi-Link-6 (WL1271/3). The device is optimized

be operated over the full range of 1.1 V to 3.6 V. The TWL1200-Q1 enables system designers easily to interface

applications processors or digital basebands to peripherals operating at a different I/O voltage levels, such as the

TI Wi-Link-6 (WL1271/3) or other SDIO/memory cards.

The TWL1200-Q1 is offered in a thin quad flat pack [TQFP (PFB)] package. Low static power consumption and

small package size make the TWL1200-Q1 an ideal choice for mobile-phone applications.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERABLE

TOP-SIDE MARKING

PART NUMBER

–40°C to 85°C

TQFP – PFB

Tape and reel

TWL1200IPFBRQ1

TWL1200Q1

(1)

For the most-current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

TERMINAL FUNCTIONS

TERMINAL

TYPE

DESCRIPTION

NAME

NO.

AUD_CLK_A

45

I/O

Connected to baseband audio subsystem; drive strength = 4 mA

AUDIO_CLK_B

41

I/O

Connected to Wi-Link-6 PCM subsystem; drive strength = 4 mA

AUD_DIR

43

I

Direction control signal for AUDIO_CLK and AUDIO_F-SYNC signals

AUDIO_F_SYNK_A

46

I/O

Connected to baseband audio subsystem; drive strength = 4 mA

AUDIO_F_SYNK_B

40

I/O

Connected to Wi-Link-6 PCM subsystem; drive strength = 4 mA

AUDIO_IN_A

16

I

Connected to baseband audio subsystem

AUD_IN_B

22

O

Connected to Wi-Link-6 PCM subsystem; drive strength = 4 mA

BT_EN_A

10

I

Connected to baseband UART subsystem

BT_EN_B

28

O

Connected to BT UART subsystem of Wi-Link-6; drive strength = 2 mA

BT_UART_CTS_A

11

I

Connected to baseband UART subsystem

BT_UART_CTS_B

27

O

Connected to BT UART subsystem of Wi-Link-6; drive strength = 4 mA

BT_UART_RTS_A

12

O

Connected to baseband UART subsystem; drive strength = 4 mA

BT_UART_RTS_B

24

I

Connected to BT UART subsystem of Wi-Link-6

BT_UART_RX_A

13

I

Connected to baseband UART subsystem

BT_UART_RX_B

25

O

Connected to BT UART subsystem of Wi-Link-6; drive strength = 8 mA

BT_UART_TX_A

15

O

Connected to baseband UART subsystem; drive strength = 8 mA

BT_UART_TX_B

23

I

Connected to BT UART subsystem of Wi-Link-6

CLK_REQ_A

9

O

Connected to baseband SDIO controller; drive strength = 4 mA

CLK_REQ_B

29

I

Connected to SD/SDIO peripheral

8, 14,

Ground

GND

20, 26

OE

42

I

Output enable (active low)

PCM_AUDIO_OUT_A

17

O

Connected to baseband audio subsystem; drive strength = 4 mA

PCM_AUD_OUT_B

21

I

Connected to Wi-Link-6 PCM subsystem

SDIO_CLK_A

1

I

SDIO_CLK_B

37

O

mA

2

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Product Folder Link(s): TWL1200-Q1