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DIP1524-01D3 Datasheet(PDF) 6 Page - STMicroelectronics

Part No. DIP1524-01D3
Description  GPS/GLONASS and 2.4 GHz diplexer
Download  9 Pages
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Maker  STMICROELECTRONICS [STMicroelectronics]
Homepage  http://www.st.com
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DIP1524-01D3 Datasheet(HTML) 6 Page - STMicroelectronics

   
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Package information
DIP1524-01D3
6/9
Doc ID 022548 Rev 1
3
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Figure 17.
Package dimensions
Figure 18.
Footprint
Figure 19.
Marking
840 µm
400 µm
630 µm
P1
GND
P3
P2
Copper pad diameter:
220 µm recommended
Solder stencil opening:
220 µm recommended
Solder mask opening:
300 µm minimum
260 µm maximum
x
y
x
w
z
w
Dot, ST logo
ECOPACK grade
xx = marking
z = manufacturing location
yww = datecode
(y = year
ww = week)


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