BurrBrown Products

from Texas Instruments

FEATURES

APPLICATIONS

WAFERCHIP-SCALEPACKAGE

(BOTTOMVIEW)

SCLK

DV

DD

PRE

FS

DGND

DOUT

AV

DD

OUTB

OUTD

OUTC

OUTA

AGND

19

20

1

2

34

56

12

11

10

9

13

14

15

16

78

17

18

DIN

OUTE

OUTF

OUTG

OUTH

REF

LDAC

MODE

DESCRIPTION

TLV5610IYZ

SBAS389A – JULY 2006 – REVISED JULY 2006

2.7V to 5.5V, 12-Bit, Octal

DIGITAL-TO-ANALOG CONVERTER

in a Wafer Chip-Scale Package—Pb-Free/Green

•

Digital Servo-Control Loops

• Eight, 12-Bit, Voltage Output DACs in One

Package

•

Digital Offset and Gain Adjustment

•

Industrial Process Control

•

Pin-Compatible, Pb-Free, RoHS-Compliant

Upgrade to the TLV5610IYE

•

Machine and Motion Control Devices

•

Mass Storage Devices

•

Programmable Settling Time versus Power

Consumption:

– 1

µs in Fast Mode

– 3

µs in Slow Mode

•

Compatible With TMS320™ DSP Family and

SPI™ Serial Ports

•

Differential and Single-Ended Analog

Input/Output

•

Separate Software Control for ADC and DAC

Power Down

•

Monotonic Over Temperature

•

Low Power Consumption:

– 18mW in Slow Mode at 3V

– 48mW in Fast Mode at 3V

•

Power Down Mode

•

Buffered, High-Impedance Reference Inputs

•

Data Output for Daisy-Chaining

The TLV5610IYZ is the lead-free version of the TLV5610IYE, an eight-channel, 12-bit, voltage output

digital-to-analog converter (DAC) with a flexible serial interface. The serial interface allows glueless interface to

TMS320 and SPI, QSPI™, and Microwire™ serial ports. It is programmed with a 16-bit serial string containing

four control and 12 data bits.

Additional features include a power-down mode, an LDAC input for simultaneous update of all eight DAC

outputs, and a data output that can be used to cascade multiple devices.

The resistor string output voltage is buffered by a rail-to-rail output amplifier with a programmable settling time to

allow the designer to optimize speed versus power dissipation. The buffered, high-impedance reference input

can be connected to the supply voltage.

The TLV5610IYZ is implemented in a CMOS process and is available in a 20-terminal wafer chip-scale package

(WCSP). The TLV5610IYZ is characterized for operation from –40

°C to +85°C in a wire-bonded small outline

(SO) package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

TMS320 is a trademark of Texas Instruments, Inc.

SPI, QSPI are trademarks of Motorola, Inc.

Microwire is a trademark of National Semiconductor Corp.

All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Copyright © 2006, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.