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TLV2474AQDRQ1 Datasheet(PDF) 18 Page - Texas Instruments |
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TLV2474AQDRQ1 Datasheet(HTML) 18 Page - Texas Instruments |
18 / 31 page TLV247xQ1, TLV247xAQ1 FAMILY OF 600 µA/Ch 2.8MHz RAILTORAIL INPUT/OUTPUT HIGHDRIVE OPERATIONAL AMPLIFIERS SGLS180B − AUGUST 2003 − REVISED APRIL 2008 18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION general PowerPAD design considerations (continued) TJ = 150°C 4 3 2 0 −55 −40 −10 20 35 5 6 MAXIMUM POWER DISSIPATION vs FREE-AIR TEMPERATURE 7 65 95 125 1 TA − Free-Air Temperature − °C DGN Package Low-K Test PCB θJA = 52.3°C/W SOT-23 Package Low-K Test PCB θJA = 324°C/W −25 5 50 80 110 PWP Package Low-K Test PCB θJA = 29.7°C/W SOIC Package Low-K Test PCB θJA = 176°C/W NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB. Figure 40. The next consideration is the package constraints. The two sources of heat within an amplifier are quiescent power and output power. The designer should never forget about the quiescent heat generated within the device, especially multi-amplifier devices. Because these devices have linear output stages (Class A-B), most of the heat dissipation is at low output voltages with high output currents. Figure 41 to Figure 46 show this effect, along with the quiescent heat, with an ambient air temperature of 70 °C and 125°C. When using VDD = 3 V, there is generally not a heat problem with an ambient air temperature of 70 °C. But, when using VDD = 5 V, the packages are severely limited in the amount of heat it can dissipate. The other key factor when looking at these graphs is how the devices are mounted on the PCB. The PowerPAD devices are extremely useful for heat dissipation. But, the device should always be soldered to a copper plane to fully use the heat dissipation properties of the PowerPAD. The SOIC package, on the other hand, is highly dependent on how it is mounted on the PCB. As more trace and copper area is placed around the device, θJA decreases and the heat dissipation capability increases. The currents and voltages shown in these graphs are for the total package. For the dual or quad amplifier packages, the sum of the RMS output currents and voltages should be used to choose the proper package. |
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