NC – No internal connection

1OUT

1

2

3

4

8

7

6

5

1IN–

1IN+

GND

2OUT

2IN–

2IN+

TLV2402-Q1

D OR DGK PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

NC

IN–

IN+

GND

NC

OUT

NC

TLV2401-Q1

D PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

14

13

12

11

10

9

8

1OUT

1IN–

1IN+

2IN+

2IN–

2OUT

4OUT

4IN–

4IN+

GND

3IN+

3IN–

3OUT

TLV2404-Q1

D OR PW PACKAGE

(TOP VIEW)

3

2

4

5

1

OUT

GND

IN+

VCC

IN–

TLV2401-Q1

DBV PACKAGE

(TOP VIEW)

TLV2401-Q1 , TLV2402-Q1, TLV2404-Q1

SLOS716

– APRIL 2011

www.ti.com

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

SLEW

BW

DEVICE

RATE

RAIL-TO-RAIL

(V)

(mV)

(MHz)

(

µA)

(V/

µs)

2.5

–16

0.390

0.005

0.002

0.880

I/O

(1)

All specifications are typical values measured at 5 V.

(2)

This device also offers 18-V reverse battery protection and 5-V over-the-rail operation on the inputs.

DEVICE INFORMATION

ORDERABLE PART NUMBER

TOP-SIDE MARKING

MSOP

– DGK

Reel of 2500

TLV2402QDGKRQ1

QWX

TLV2401QDRQ1

SOIC

– D

Reel of 2500

TLV2402QDRQ1

Product Preview

–40°C to 125°C

TLV2404QDRQ1

SOT

– DBV

Reel of 3000

TLV2401QDBVRQ1

Product Preview

TSSOP

– PW

Reel of 2000

TLV2404QPWRQ1

Product Preview

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

2

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Copyright

© 2011, Texas Instruments Incorporated

Product Folder Link(s): TLV2401-Q1 TLV2402-Q1 TLV2404-Q1