TLC5940-EP

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SLVSA51D – MARCH 2010 – REVISED MAY 2010

THERMAL CHARACTERISTICS

over operating free-air temperature range (unless otherwise noted)

RHB

PWP

UNIT

32 PINS

28 PINS

33.9

35.4

°C/W

30

24.94

°C/W

3.9

5.37

°C/W

9.3

15.02

°C/W

0.619

1.297

°C/W

9.3

10.96

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as

specified in JESD51-7, in an environment described in JESD51-2a.

(3)

The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific

JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4)

The junction to case (bottom) thermal resistance is obtained by simulations of this device as configured per MilStd 883 method 1012.1.

(5)

The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB

temperature, as described in JESD51-8.

(6)

The junction-to-top characterization parameter,

(7)

The junction-to-board characterization parameter,

ABSOLUTE MAXIMUM RATINGS.

over operating free-air temperature range (unless otherwise noted)

(1) (2)

UNIT

VCC

–0.3V to 6V

Output current (dc)

130mA

Input voltage range

Output voltage range

–0.3V to 18V

EEPROM program range

–0.3V to 24V

EEPROM write cycles

25

HBM (JEDEC JESD22-A114, Human Body Model)

2kV

ESD rating

CBM (JEDEC JESD22-C101, Charged Device Model)

500V

Storage temperature range

–55°C to 150°C

Operating ambient temperature range

–40°C to 125°C

Package thermal impedance

See Thermal Characteristics table

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

(2)

Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of

overall device life. See www.ti.com/ep_quality for additional information on enhanced plastic packaging.

(3)

All voltage values are with respect to network ground terminal.

Copyright © 2010, Texas Instruments Incorporated

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