1A

1Y

1

6

2A

2Y

3

4

SN74AUP2G07

SCES748B – SEPTEMBER 2009 – REVISED MAY 2010

www.ti.com

The output of the SN74AUP2G07 is open drain and can be connected to other open-drain outputs to implement

active-low wired-OR or active-high wired-AND functions.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERABLE PART NUMBER

NanoStar™ – WCSP (DSBGA)

Reel of 3000

SN74AUP2G07YFPR

_ _ _ H V _

0.23-mm Large Bump – YFP (Pb-free)

QFN – DRY

Reel of 5000

SN74AUP2G07DRYR

H5

–40°C to 85°C

uQFN – DSF

Reel of 5000

SN74AUP2G07DSFR

H5

SOT (SC-70) – DCK

Reel of 3000

SN74AUP2G07DCKR

H5_

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

DCK/DRY: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

● = Pb-free).

FUNCTION TABLE

INPUT

OUTPUT

A

Y

L

L

H

Z

LOGIC DIAGRAM (POSITIVE LOGIC)

2

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Product Folder Link(s): SN74AUP2G07