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SN65MLVD040RGZR Datasheet(PDF) 4 Page - Texas Instruments |
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SN65MLVD040RGZR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 29 page SN65MLVD040 SLLS902 – FEBRUARY 2010 www.ti.com PACKAGE DISSIPATION RATINGS PCB JEDEC TA ≤ 25°C DERATING FACTOR(1) TA = 85°C PACKAGE POWER RATING ABOVE TA = 25°C POWER RATING STANDARD RGZ Low-K(2) 1298 mW 12.98 mW/°C 519 mW RGZ High-K(3) 3448 mW 34.48 mW/°C 1379 mW (1) This is the inverse of the junction-to-ambient thermal resistance when board mounted and with no air flow. (2) In accordance with the Low-K thermal metric definitions of EIA/JESD51-3. (3) In accordance with the High-K thermal metric definitions of EIA/JESD51-7. THERMAL CHARACTERISTICS PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RqJB Junction-to-board thermal resistance 9 °C/W RqJC Junction-to-case thermal resistance 20 °C/W RqJP Junction-to-pad thermal resistance 1.37 °C/W Device power dissipation (See typical REat 0 V, DE at 0 V, CL = 15 pF, VID = 400 mW, PD 382 mW curves for additional information) 125 MHz, All others open ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted (1) SN65MLVD040 Supply voltage range(2), VCC –0.5 V to 4 V D, DE, RE, FSEN –0.5 V to 4 V Input voltage range A, B –1.8 V to 4 V R –0.3 V to 4 V Output voltage range A, or B –1.8 V to 4 V Human Body Model(3) All pins ±7 kV Electrostatic discharge Charged-Device Model(4) All pins ±1500 V Storage temperature range –65°C to 150°C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values, except differential I/O bus voltages, are with respect to network ground terminal. (3) Tested in accordance with JEDEC Standard 22, Test Method A114-E. Bus pin stressed with respect to a common connection of GND and VCC (4) Tested in accordance with JEDEC Standard 22, Test Method C101-D. RECOMMENDED OPERATING CONDITIONS MIN NOM MAX UNIT VCC Supply voltage 3 3.3 3.6 V VIH High-level input voltage 2 VCC V VIL Low-level input voltage GND 0.8 V Voltage at any bus terminal VA or VB –1.4 3.8 V |VID| Magnitude of differential input voltage 0.05 VCC V TA Operating free-air temperature –40 85 °C Maximum junction temperature 140 °C 4 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s) :SN65MLVD040 |
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