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OPA1662AIDR Datasheet(PDF) 5 Page - Texas Instruments |
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OPA1662AIDR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 29 page OPA1662 OPA1664 www.ti.com SBOS489 – DECEMBER 2011 ELECTRICAL CHARACTERISTICS: VS = +5 V (continued) At TA = +25°C and RL = 2 kΩ, unless otherwise noted. VCM = VOUT = midsupply, unless otherwise noted. OPA1662, OPA1664 PARAMETER CONDITIONS MIN TYP MAX UNIT OPEN-LOOP GAIN AOL Open-loop voltage gain (V –) + 0.6 V ≤ VO ≤ (V+) – 0.6 V, RL = 2 kΩ 90 100 dB OUTPUT VOUT Output voltage RL = 2 kΩ (V –) + 0.6 (V+) – 0.6 V IOUT Output current See Typical Characteristics mA ZO Open-loop output impedance See Typical Characteristics Ω ISC Short-circuit current(3) ±40 mA CLOAD Capacitive load drive 200 pF POWER SUPPLY VS Specified voltage range ±1.5 ±18 V IOUT = 0 A 1.4 1.7 mA Quiescent current IQ (per channel) IOUT = 0 A, TA = –40°C to +85° (2) 2 mA TEMPERATURE Specified range –40 +85 °C Operating range –55 +125 °C (3) One channel at a time. THERMAL INFORMATION: OPA1662 OPA1662 THERMAL METRIC(1) D (SO) DGK (MSOP) UNITS 8 PINS 8 PINS θJA Junction-to-ambient thermal resistance 156.3 225.4 θJCtop Junction-to-case (top) thermal resistance 85.5 78.8 θJB Junction-to-board thermal resistance 64.9 110.5 °C/W ψJT Junction-to-top characterization parameter 33.8 14.6 ψJB Junction-to-board characterization parameter 64.3 108.5 θJCbot Junction-to-case (bottom) thermal resistance N/A N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. THERMAL INFORMATION:OPA1664 OPA1664 THERMAL METRIC(1) D (SO) PW (TSSOP) UNITS 14 PINS 14 PINS θJA Junction-to-ambient thermal resistance 78.6 125.8 θJCtop Junction-to-case (top) thermal resistance 37.0 45.2 θJB Junction-to-board thermal resistance 24.9 57.5 °C/W ψJT Junction-to-top characterization parameter 9.7 5.5 ψJB Junction-to-board characterization parameter 24.6 56.7 θJCbot Junction-to-case (bottom) thermal resistance N/A N/A (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2011, Texas Instruments Incorporated 5 Product Folder Link(s): OPA1662 OPA1664 |
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