200

400

600

800

1000

0

100

80

60

40

20

0

Air Velocity − linear ft/min

Junction-to-Ambient

Thermal Resistance

vs

Air Velocity

24-Pin DW Package

24-Pin NT Package

28-Pin DW Package

28-Pin NT Package

SN100KT5541

OCTAL ECLTOTTL TRANSLATOR

WITH 3STATE OUTPUTS

SDZS004A − NOVEMBER 1989 − REVISED MAY 1990

5

POST OFFICE BOX 655303

POST OFFICE BOX 1443

THERMAL INFORMATION

In digital system designs utilizing 100KT’ or 10KHT’

series

logic

level

translators,

good

thermal

management is an important consideration for proper

circuit performance and extended reliability. The size of

the

“small

outline”

package

makes

thermal

management even more important due to the increased

board and thermal densities.

The thermal resistances in Figure 1 can be used to

approximate typical and maximum virtual junction

temperatures for the SN100KT’ and SN10KHT’

translators. The junction temperature of these devices

may be estimated using Equation 1.

(1)

where

SN10KHT’ − (− 5.2 V Typ, − 5.46 V Max)

SN100KHT’ − (− 54.5 V Typ, − 4.80 V Max)