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SN74SSQEB32882

SCAS896-PUB – JUNE 2010

www.ti.com

PACKAGE INFORMATION

Pinout Configuration

The package is a 8mm × 13.5mm 176-pin BGA with 0.65mm ball pitch in a 11 × 20 grid. The device pinout

supports outputs on the outer two left and right columns to support easy DIMM signal routing. Corresponding

inputs are placed in a way that two devices can be placed back to back for 4 Rank modules while the data inputs

share the same vias. Each input and output is located close to an associated no ball position or on the outer two

rows to allow low cost via technology combined with the small 0.65mm ball pitch.

Figure 1. Pinout Configuration

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