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SN74LVTH125-EP Datasheet(PDF) 1 Page - Texas Instruments |
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SN74LVTH125-EP Datasheet(HTML) 1 Page - Texas Instruments |
1 / 9 page SN74LVTH125EP 3.3V ABT QUADRUPLE BUS BUFFER WITH 3STATE OUTPUTS SCBS765 − NOVEMBER 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Controlled Baseline − One Assembly/Test Site, One Fabrication Site D Enhanced Diminishing Manufacturing Sources (DMS) Support D Enhanced Product-Change Notification D Qualification Pedigree† D Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC) D Supports Unregulated Battery Operation Down to 2.7 V D Typical VOLP (Output Ground Bounce) <0.8 V at VCC = 3.3 V, TA = 25°C † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. D Ioff and Power-Up 3-State Support Hot Insertion D Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors D Latch-Up Performance Exceeds 500 mA Per JESD 17 D ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) description/ordering information This bus buffer is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. The SN74LVTH125 features independent line drivers with 3-state outputs. Each output is in the high-impedance state when the associated output-enable (OE) input is high. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. ORDERING INFORMATION TA PACKAGE‡ ORDERABLE PART NUMBER TOP-SIDE MARKING −40 °C to 85°C TSSOP − PW Tape and reel SN74LVTH125IPWREP LH125EP ‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 2003, Texas Instruments Incorporated Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PW PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 14 13 12 11 10 9 8 1OE 1A 1Y 2OE 2A 2Y GND VCC 4OE 4A 4Y 3OE 3A 3Y |
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