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MCM72F6ADG12 Datasheet(PDF) 6 Page - Motorola, Inc |
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MCM72F6ADG12 Datasheet(HTML) 6 Page - Motorola, Inc |
6 / 10 page ![]() MCM72F6A •MCM72F7A 6 MOTOROLA FAST SRAM ABSOLUTE MAXIMUM RATINGS (Voltages Referenced to VSS = 0 V) Rating Symbol Value Unit Power Supply Voltage VDD – 0.5 to + 4.6 V Voltage Relative to VSS Vin, Vout – 0.5 to + 6.0 V Output Current (per I/O) Iout ± 20 mA Power Dissipation MCM72F6A MCM72F7A PD 4.6 9.2 W Temperature Under Bias Tbias – 10 to + 85 °C Storage Temperature Tstg – 55 to + 125 °C NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to RECOMMENDED OPER- ATING CONDITIONS. Exposure to higher than recommended voltages for extended periods of time could affect device reliability. DC OPERATING CONDITIONS AND CHARACTERISTICS (VDD = 3.3 V + 10%, – 5%, TA = 0 to 70°C, Unless Otherwise Noted) RECOMMENDED OPERATING CONDITIONS (Voltages Referenced to VSS = 0 V) Parameter Symbol Min Max Unit Supply Voltage (Operating Voltage Range) VDD 3.135 3.6 V Input High Voltage VIH 2.0 5.5** V Input Low Voltage VIL – 0.5* 0.8 V *VIL ≥ – 2.0 V for t ≤ tKHKH/2. ** VIH ≤ 6 V for tKHKH/2. DC CHARACTERISTICS Parameter Symbol Min Max Unit Input Leakage Current (0 V ≤ Vin ≤ VDD) Ilkg(I) — ± 1.0 µA Output Leakage Current (0 V ≤ Vin ≤ VDD) Ilkg(O) — ± 1.0 µA Output Low Voltage (IOL = + 8.0 mA) VOL — 0.4 V Output High Voltage (IOH = – 4.0 mA) VOH 2.4 — V POWER SUPPLY CURRENTS Parameter Symbol Min Max Unit AC Supply Current (Device Selected, All Outputs Open, MCM72F6ADG9 Cycle Time ≥ tKHKH min) MCM72F6ADG10 MCM72F6ADG12 MCM72F7ADG9 MCM72F7ADG10 MCM72F7ADG12 IDDA — 900 860 840 1800 1720 1680 mA CMOS Standby Supply Current (Deselected, MCM72F6ADG9 Clock (K) Cycle Time ≥ tKHKH, All Inputs Toggling at MCM72F6ADG10 CMOS Levels Vin ≤ VSS + 0.2 V or ≥ VDD – 0.2 V) MCM72F6ADG12 MCM72F7ADG9 MCM72F7ADG10 MCM72F7ADG912 ISB1 — 440 400 380 880 800 760 mA Clock Running Supply Current (Deselected, MCM72F6ADG9 Clock (K) Cycle Time ≥ tKHKH, All Other Inputs MCM72F6ADG10/12 Held to Static CMOS Levels Vin ≤ VSS + 0.2 V MCM72F7ADG9 or ≥ VDD – 0.2 V) MCM72F7ADG10/12 ISB2 — 160 140 320 280 mA MCM72F6A CAPACITANCE (f = 1.0 MHz, dV = 3.0 V, TA = 0 to 70°C, Periodically Sampled Rather Than 100% Tested) Parameter Symbol Typ Max Unit Input Capacitance W, K Other Inputs Cin — — 16 36 pF I/O Capacitance CI/O — 19 pF This device contains circuitry to protect the inputs against damage due to high static volt- ages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high–impedance circuit. This BiCMOS memory circuit has been designed to meet the dc and ac specifications shown in the tables, after thermal equilibrium has been established. This device contains circuitry that will ensure the output devices are in High–Z at power up. |
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