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LM3447MTE Datasheet(PDF) 2 Page - Texas Instruments |
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LM3447MTE Datasheet(HTML) 2 Page - Texas Instruments |
2 / 25 page LM3447 SNOSC65 A – APRIL 2012 – REVISED MAY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TEMPERATURE ORDERABLE DEVICE TRANSPORT RANGE PACKAGE(2) PINS PACKAGE DRAWING QUANTITY NUMBER MEDIA (TJ) LM3447MT Tube 94 –40°C to 125°C TSSOP 14 MTC14 LM3447MTE Tape and Reel 250 LM3447MTX Tape and Reel 2500 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. ABSOLUTE MAXIMUM RATINGS (1) All voltages are with respect to GND, –40°C < TJ = TA < 125°C, all currents are positive into and negative out of the specified terminal (unless otherwise noted) VALUE UNIT MIN MAX Supply voltage VCC(2) –0.3 22 V HOLD(3) –0.3 22 V Input voltage range VAC(4) –0.3 6 V TSNS, FLT1, FLT2, FF, INV, COMP, ISNS, AUX –0.3 6 V Output voltage range GATE(2) (Pulse < 20ns) –1.5 19 V Continuous input current IBIAS (4) 10 mA Junction temperature TJ (5) 165 °C Storage temperature range(5) TSTG –65 150 °C Lead temperature Soldering, 10s 260 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) VCC is internally limited to approximately 18.9V. See ELECTRICAL CHARACTERISTICS table. (3) HOLD current is limited by the internal power dissipation of the device. (4) Voltage on VAC and BIAS is internally clamped. The clamp level varies with operating conditions. In normal use, VAC and BIAS are current fed with the voltage internally limited. (5) Maximum junction temperature is internally limited. PACKAGE DISSIPATION RATINGS (1) (2) θJA, THERMAL IMPEDANCE JUNCTION TA = 25°C TA = 70°C TA = 85°C PACKAGE TO AMBIENT,NO AIRFLOW POWER RATING POWER RATING POWER RATING (°C/W) (mW) (mW) (mW) TSSOP–14 (MTC) 155(1) 645(3) 355(3) 258(3) (1) Tested per JEDEC EIA/JESD51-1. Thermal resistance is a function of board construction and layout. Air flow reduces thermal resistance. This number is included only as a general guideline; see TI document (SPRA953) device Package Thermal Metrics. (2) Thermal resistance to the circuit board is lower. Measured with standard single-sided PCB construction. Board temperature, TB, measured approximately 1 cm from the lead to board interface. This number is provided only as a general guideline. (3) Maximum junction temperature, TJ, equal to 125°C 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Links: LM3447 |
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