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ISO7221C-HT Datasheet(PDF) 7 Page - Texas Instruments |
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ISO7221C-HT Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 16 page 
OUT 8 W 13 W IN 750kW 500 W Input Output VCC1 VCC1 VCC1 VCC2 ISO7221C-HT www.ti.com SLLSE78 – APRIL 2011 DEVICE INFORMATION DEVICE I/O SCHEMATICS SOIC-8 PACKAGE THERMAL CHARACTERISTICS over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Low-K Thermal Resistance(1) 212 θJA Junction-to-air High-K Thermal Resistance 122 °C/W θJB Junction-to-Board Thermal Resistance 37 θJC Junction-to-Case Thermal Resistance 69.1 (1) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages. DEVICE FUNCTION TABLE Table 1. Function Table(1) INPUT SIDE VCC OUTPUT SIDE VCC INPUT IN OUTPUT OUT H H PU PU L L Open H PD PU X H (1) PU = Powered Up(Vcc ≥ 3.0V); PD = Powered Down (Vcc ≤ 2.5V); X = Irrelevant; H = High Level; L = Low Level Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Link(s) :ISO7221C-HT |
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