 |
Electronic Components Datasheet Search |
|
|
Electronic Components Datasheet Search |
|
574004U00000G Datasheet(PDF) 24 Page - Aavid, Thermal Division of Boyd Corporation |
|
||||||||||||||||||||||||||||||
574004U00000G Datasheet(HTML) 24 Page - Aavid, Thermal Division of Boyd Corporation |
|
|
24 / 116 page 
24 EUROPE ASIA Italy Tel: +39 051 764011 email: sales.it@aavid.com United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw AMERICA USA Tel: +1 (603) 224-9988 email: info@aavid.com www.aavidthermalloy.com ORDERING INFORMATION 5731 Surface mount heat sink for D-PAK (TO-252) package semiconductors Surface mount heat sink for D-PAK (TO-252) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. 1.3 (0.05) 8.00 (0.315) 22.86 (0.900) 10.16 (0.400) 10.41 (0.410) 8.13 (0.320) Part Number Packaging 573100D00010G 13" Reel, 250 per reel 573100D00000G Bulk, 500 per bag Air Velocity—Feet Per Minute Heat Dissipated—Watts 25 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 2.5 20 15 5 10 0 0 400 200 600 800 1000 ORDERING INFORMATION 1.3 (0.05) 12.70 (0.500) 26.16 (1.030) 10.16 (0.400) 12.70 (0.500) 7.37 (0.290) Part Number Packaging 573300D00010G 13" Reel, 250 per reel 573300D00000G Bulk, 500 per bag Air Velocity—Feet Per Minute Heat Dissipated—Watts 20 0 10 20 30 40 50 0.0 0.5 1.0 1.5 2.0 2.5 16 12 4 8 0 0 400 200 600 800 1000 Surface mount heat sink for D 2 PAK (TO-263) package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. 5733 Surface mount heat sink for D 2 PAK (TO-263) package semiconductors 7106 Surface mount heat sink for D 2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors Surface mount heat sink for D 2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors remove the heat indirectly without contacting the device like traditional through hole heat sinks. The device and the heat sink are soldered directly to a modified drain pad creating a thermal transfer path from package tab to the heat sink. Air Velocity—Feet Per Minute Heat Dissipated—Watts 10 0 20 40 60 80 100 01 2 3 4 5 8 6 2 4 0 0 400 200 600 800 1000 Part Number Packaging 7106D/TRG 13" Reel, 200 per reel 7106DG Bulk, 500 per bag ORDERING INFORMATION Material: 0.63 (0.025) Thick Copper Finish: Tin Plated SMT See page 25 for tape and reel information Refer to Figure A and B on page 26 for board footprint information See page 25 for tape and reel information Material: 0.63 (0.025) Thick Copper Finish: Tin Plated Refer to Figure A and B on page 26 for board footprint information See page 25 for tape and reel information Refer to Figure C on page 26 for board footprint information 25.91 (1.020) 10.16 (0.400) 7.62 (0.300) 9.52 (0.375) 14.99 (0.590) 10.92 (0.430) 14.99 (0.590) 5.33 (0.210) Material: 0.63 (0.025) Thick Copper Finish: Tin Plated |
|
English ▼
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
