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574004U00000G Datasheet(PDF) 24 Page - Aavid, Thermal Division of Boyd Corporation

Part No. 574004U00000G
Description  Channel style heat sink with folded back fins
Download  116 Pages
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Maker  AAVID [Aavid, Thermal Division of Boyd Corporation]
Homepage  https://www.boydcorp.com/aavid.html
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574004U00000G Datasheet(HTML) 24 Page - Aavid, Thermal Division of Boyd Corporation

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24
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
5731
Surface mount heat sink for D-PAK (TO-252) package semiconductors
Surface mount heat sink for D-PAK
(TO-252) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
1.3
(0.05)
8.00
(0.315)
22.86
(0.900)
10.16
(0.400)
10.41
(0.410)
8.13
(0.320)
Part Number
Packaging
573100D00010G
13" Reel, 250 per reel
573100D00000G
Bulk, 500 per bag
Air VelocityFeet Per Minute
Heat DissipatedWatts
25
0
20
40
60
80
100
0.0
0.5
1.0
1.5
2.0
2.5
20
15
5
10
0
0
400
200
600
800
1000
ORDERING INFORMATION
1.3
(0.05)
12.70
(0.500)
26.16
(1.030)
10.16
(0.400)
12.70
(0.500)
7.37
(0.290)
Part Number
Packaging
573300D00010G
13" Reel, 250 per reel
573300D00000G
Bulk, 500 per bag
Air VelocityFeet Per Minute
Heat DissipatedWatts
20
0
10
20
30
40
50
0.0
0.5
1.0
1.5
2.0
2.5
16
12
4
8
0
0
400
200
600
800
1000
Surface mount heat sink for D
2 PAK
(TO-263) package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
5733
Surface mount heat sink for D
2 PAK (TO-263) package semiconductors
7106
Surface mount heat sink for D
2 PAK (TO-263), power SO-10 (MO-184) and SO-10 package semiconductors
Surface mount heat sink for D
2 PAK
(TO-263), power SO-10 (MO-184)
and SO-10 package semiconductors
remove the heat indirectly without
contacting the device like traditional
through hole heat sinks. The device
and the heat sink are soldered directly
to a modified drain pad creating a
thermal transfer path from package
tab to the heat sink.
Air VelocityFeet Per Minute
Heat DissipatedWatts
10
0
20
40
60
80
100
01
2
3
4
5
8
6
2
4
0
0
400
200
600
800
1000
Part Number
Packaging
7106D/TRG
13" Reel, 200 per reel
7106DG
Bulk, 500 per bag
ORDERING INFORMATION
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
SMT
See page 25 for tape and reel information
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated
Refer to Figure A and B on page 26 for board footprint information
See page 25 for tape and reel information
Refer to Figure C on page 26 for board footprint information
25.91
(1.020)
10.16
(0.400)
7.62
(0.300)
9.52
(0.375)
14.99
(0.590)
10.92
(0.430)
14.99
(0.590)
5.33
(0.210)
Material: 0.63 (0.025) Thick Copper
Finish: Tin Plated


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