574004U00000G datasheet(87/116 Pages) AAVID

Part #	574004U00000G

Description	Channel style heat sink with folded back fins

Download	116 Pages

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Manufacturer	AAVID [Aavid, Thermal Division of Boyd Corporation]

Direct Link	https://www.boydcorp.com/aavid.html

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EUROPE

ASIA

Italy Tel: +39 051 764011 email: sales.it@aavid.com

United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com

Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg

Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw

AMERICA

USA Tel: +1 (603) 224-9988 email: info@aavid.com

www.aavidthermalloy.com

Alignment Pads

Aavid Thermalloy has added a phase change

pad to its line-up. These pads provide low

thermal resistance and electrical isolation

for low pressure spring mount applications.

Above the phase change temperature the

material flows to fill in surface irregularities

and maximize the heat conduction path.

Interface Material/Pads

Solderable alignment pads are an innovative

way to attach the heat sink to your transistor that

could cut your assembly time by more than half.

Alignment pads provide cost effective solderability,

while providing numerous additional benefits.

Alignment pads are factory applied and can be

bought separately as well. Please refer to accessory

Index D on page 85.

Suffix

Device

Figure

8223-CL03G

TO-220

B

8241-CL11G

TO-218

A

Hi-Flow® *

(1.000)

25.40

(0.030)

0.76

(0.122)

3.10

(0.985)

25.02

(0.520)

13.21

(1.200)

30.48

(0.860)

21.84

9.40

(0.370)

5.08

(0.200)

3.25

(0.128)

1

CLIP ASSEMBLY

CL

(0.460)

11.68

(0.300)

7.62

(0.670)

17.02

0.51

(0.020)

TYP THK

14.22

(0.560)

3.18

(0.125)

0.76

(0.030)

(0.860)

21.84

5.08

(0.200)

(0.790)

20.07

Figure A

ORDERING INFORMATION

example

Thermalloy origin part 7022B–8223–CL03 G

A

B

A = Model number

B = Alignment pad

C = RoHS compliant

Figure B

Typical installation

Shown with part number 8241-CL11

Recommended hole pattern for 8223-CL03G

Recommended hole pattern for 8241-CL11G

14.73

(0.580)

7.37

(0.290)

2.54

(0.100)

2.54

(0.100)

PLATED THRU HOLE PER

DEVICE MANUFACTURERS

RECOMMENDATION

2.95

(0.116)

DIA PLATED

THRU HOLE

25.40

(1.000)

12.70

(0.500)

5.46

(0.215)

2.95

(0.116)

DIA PLATED

THRU HOLE

5.46

(0.215)

1.60

(0.063)

DIA PLATED

THRU HOLE

TYP(3)

TYP(2)

C

Reinforcement carrier

Polymide

Thickness

0.127 (0.005)

Continuous use temp (°C)

150

Phase change temp(°C)

55

Dielectric breakdown voltage (Vac)

5000

Dielectric constant (1000 Hz)

4.5

Volume resistivity (Ohm-meter)

1012

MATERIAL PROPERTIES

(1.650)

41.91

(1.140)

28.96

2X

(0.093)

2.36

2X

(0.140)

3.56

ø

21.84

(0.860)

18.80

(0.740)

2.69

(0.160)

16.76

(0.660)

DIA

19.05

(0.750)

12.70

(0.500)

3.73

(0.147)

14.30

(0.563)

DIA

TO-3

TO-220

TO-218

530101B _ 5150G

Ordering code

ORDERING INFORMATION

example 12 digit part

Ordering code

Description

0

No pads

7

One Hi-Flow® pad

8

Two Hi-Flow® pads

The shape and hole pattern of the heat sink will determine the shape and hole

pattern of the pad. If you are ordering a heat sink which mounts to a semicon-

ductor on both sides, the ordering code for two pads should be used. To order

additional Hi-Flow® pads separate, or factory applied variations please contact

an Aavid sales rep for inquiries.

Thermal impedance vs. pressure

Pressure

10

25

50

200

TO-220 Thermal performance (ºC/W)

1.15

1.14

1.12

1.1

* Hi-Flow® is a registered trademark of the Bergquist Company

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