0.20

(.008)

0.50 ± 0.1

(.020 ± .004)

0.55 ± 0.1

(.022 ± .004)

0.40

(.016)

0.30

(.012)

1.00 ± 0.1

(.039 ± .004)

0.20

(.008)

0.50

(.020)

0.40

(.016)

0.50

(.020)

0.50

(.020)

Features

characteristics

Applications

CW100505 Series High Q Ceramic Chip Inductors

*RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.

** Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be

“halogen free” if (a) the Bromine (Br ) content is 900 ppm or less; (b) the Chlorine ( Cl ) content is 900 ppm or less;

and (c) the total Bromine (Br) and Chlorine ( Cl ) content is 1500 ppm or less.

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Operating Temperature

................................-55 °C to +125 °C

(Temperature rise included)

Storage Temperature

................................-55 °C to +125 °C

Resistance to Soldering Heat

.......................... +260 °C, 5 sec. max.

Temperature Rise .....15 °C at rated Irms

Electrical Specifications

Inductance

Q

Test Freq.

(MHz)

SRF

(MHz)

DCR

(Ohms)

Irms

(mA)

L (nH)

Tol.

Min.

L / Q

Min.

Max.

CW100505-1N0D

1.0

±0.3 nH

13

250

6000

0.045

1360

CW100505-2N2D

2.2

±0.3 nH

18

250

6000

0.070

960

CW100505-2N7D

2.7

±0.3 nH

16

250

6000

0.120

640

CW100505-3N3J

3.3

±5 %

20

250

6000

0.066

840

CW100505-3N9J

3.9

±5 %

20

250

5800

0.066

840

CW100505-4N7J

4.7

±5 %

15

250

4775

0.130

640

CW100505-5N6J

5.6

±5 %

23

250

5800

0.083

760

CW100505-6N8J

6.8

±5 %

20

250

4800

0.083

680

CW100505-8N2J

8.2

±5 %

25

250

4400

0.104

680

CW100505-10NJ

10.0

±5 %

23

250

3900

0.195

480

CW100505-12NJ

12.0

±5 %

26

250

3600

0.120

640

CW100505-15NJ

15.0

±5 %

26

250

3280

0.172

560

CW100505-18NJ

18.0

±5 %

25

250

3100

0.230

420

CW100505-22NJ

22.0

±5 %

25

250

2800

0.300

400

CW100505-27NJ

27.0

±5 %

26

250

2480

0.298

400

CW100505-33NJ

33.0

±5 %

24

250

2350

0.350

400

CW100505-39NJ

39.0

±5 %

25

250

2100

0.550

320

CW100505-47NJ

47.0

±5 %

26

200

2100

0.830

210

CW100505-56NJ

56.0

±5 %

22

200

1760

0.970

200

CW100505-68NJ

68.0

±5 %

22

200

1620

1.120

180

CW100505-82NJ

82.0

±5 %

20

150

1500

1.250

150

CW100505-R10J

100.0

±5 %

20

150

1300

2.520

120

CW100505-R12J

120.0

±5 %

20

150

1100

2.660

110

General Specifications

Core...........................................Ceramic

Wire ............Enameled copper (Class H)

Terminal ........................... Mo/Mn+Ni+Au

Materials

Product Dimensions

DIMENSIONS:

MM

(INCHES)

Recommended Layout

Schematic

Soldering Profile

0

Time (Seconds)

50

100

150

200

250

50

100

150

200

250

70 SECONDS MAX.

Temperature

Rising

Area

4 °C/

Sec.

Max.

-

50 SECONDS MAX.

PEAK TEMP.

260 °C

230 °C

-

-

Preheat

Area

150~200 °C / 60~120 Sec.

-

Reflow

Area

20~

40 °C/

Sec.

Max.

-

Forced Cooling

Area

-1~5 °C/Sec. Max.