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CC1151TRHBRG4Q1 Datasheet(PDF) 5 Page - Texas Instruments |
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CC1151TRHBRG4Q1 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 94 page  CC11x1-Q1 www.ti.com SWRS076B – 11-07-22-013 - APRIL 2009 – REVISED APRIL 2010 2 Electrical Specifications 2.1 Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) VDD Supply voltage(2) –0.3 V to 3.9 V Voltage on any digital pin –0.3 V to (VDD + 0.3 V) (3) Voltage on the pins RF_P, RF_N, DCOUPL1 and DCOUPL2 –0.3 V to 2 V Voltage ramp-up rate 120 kV/µs Input RF level 10 dBm Tstg Storage temperature range –50°C to 150°C Tsolder Solder reflow temperature(4) 260°C Human-Body Model (HBM)(6) ±750 V ESD Electrostatic discharge rating(5) Charged-Device Model (CDM)(7) ±200 V Machine Model (MM)(8) ±100 V (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All supply pins must have the same voltage. (3) Maximum voltage is 3.9 V. (4) Measured according to IPC/JEDEC J-STD-020C (5) High-sensitivity UHF devices must be handled with special care to avoid ESD damage. TI is not responsible for damage to this device caused by external ESD conditions. The following electrostatic discharge (ESD) precautions are recommended: • Protective outer garments • Handling in ESD-safeguarded work area • Transporting in ESD-shielded containers • Frequent monitoring and testing of all ESD-protection equipment (6) Measured according to JEDEC STD 22, Method A114 (7) Measured according to JEDEC STD 22, C101C (8) Measured according to JEDEC STD 22, Method A115A 2.2 Recommended Operating Conditions MIN MAX UNIT VDD Supply voltage 1.8 3.6 V I temperature suffix –40 85 TA Operating free-air temperature T temperature suffix –40 105 °C Q temperature suffix –40 125 2.3 General Characteristics PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 310 348 Frequency range TA = –40°C to 105°C, VDD = 1.8 V to 3.3 V 420 450 MHz 779 928 The data rate step size is determined by the reference frequency – 1.2 250 see Data Rate Programming Data rate(1) kBaud Shaped MSK (also known as differential offset QPSK) 26 to 250 Device weight 0.0715 g (1) Optional Manchester encoding halves the data rate. Copyright © 2009–2010, Texas Instruments Incorporated Electrical Specifications 5 Submit Documentation Feedback |
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