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DAC716UBG4 Datasheet(PDF) 3 Page - Texas Instruments |
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DAC716UBG4 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 16 page 3 ® DAC716 DIFFERENTIAL LINEARITY ERROR TEMPERATURE PRODUCT PACKAGE T MIN to TMAX RANGE DAC716P Plastic DIP ±8 LSB –40 °C to +85°C DAC716U Plastic SOIC ±8 LSB –40 °C to +85°C DAC716PB Plastic DIP ±4 LSB –40 °C to +85°C DAC716UB Plastic SOIC ±4 LSB –40 °C to +85°C DAC716PK Plastic DIP ±2 LSB 0 °C to +70°C DAC716UK Plastic SOIC ±2 LSB 0 °C to +70°C PIN CONFIGURATION Top View ELECTROSTATIC DISCHARGE SENSITIVITY Electrostatic discharge can cause damage ranging from per- formance degradation to complete device failure. Burr- Brown Corporation recommends that all integrated circuits be handled and stored using appropriate ESD protection methods. ESD damage can range from subtle performance degrada- tion to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published specifications. PIN DESCRIPTIONS PIN LABEL DESCRIPTION 1 CLK Serial Data Clock 2A0 Enable for Input Register (Active Low) 3A1 Enable for D/A Latch (Active Low) 4 SDI Serial Data Input 5 SDO Serial Data Output 6 DCOM Digital Supply Ground 7+VCC Positive Power Supply 8 ACOM Analog Supply Ground 9VOUT D/A Output 10 NC No Connection 11 NC No Connection 12 VREF OUT Voltage Reference Output 13 Offset Adjust Offset Adjust 14 Gain Adjust Gain Adjust 15 –VCC Negative Power Supply 16 CLR Clear ORDERING INFORMATION SOIC/DIP +VCC to Common .................................................................... 0V to +17V –VCC to Common .................................................................... 0V to –17V +VCC to –VCC ....................................................................................... 34V ACOM to DCOM ............................................................................... ±0.5V Digital Inputs to Common ............................................. –1V to (VCC –0.7V) External Voltage Applied to BPO and Range Resistors ..................... ±V CC VREF OUT ......................................................... Indefinite Short to Common V OUT ............................................................... Indefinite Short to Common SDO ............................................................... Indefinite Short to Common Power Dissipation .......................................................................... 750mW Storage Temperature ...................................................... –60 °C to +150°C Lead Temperature (soldering, 10s) ................................................ +300 °C NOTE: (1) Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. ABSOLUTE MAXIMUM RATINGS(1) CLK A 0 A 1 SDI SDO DCOM +V CC ACOM DAC716 CLR –V CC Gain Adjust Offset Adjust V REF OUT NC NC V OUT 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems. PACKAGE DRAWING PRODUCT PACKAGE NUMBER(1) DAC716P Plastic DIP 180 DAC716U Plastic SOIC 211 NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. PACKAGE INFORMATION |
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