ADS7870

SBAS124C − DECEMBER 1999 − REVISED DECEMBER 2005

www.ti.com

2

PRODUCT

PACKAGE-LEAD

PACKAGE

DESIGNATOR

SPECIFIED

TEMPERATURE

RANGE

PACKAGE

MARKING

ORDERING

NUMBER

TRANSPORT MEDIA,

QUANTITY

ADS7870

SSOP-28 Surface Mount

DB

−40

°C to +85°C

ADS7870

ADS7870IDB

Rails, 48

ADS7870

SSOP-28 Surface Mount

DB

−40

°C to +85°C

ADS7870

ADS7870IDBR

Tape and Reel, 1000

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI web

site at www.ti.com.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to

damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

UNIT

Supply voltage, VDD

5.5 V

Input current

Momentary

100 mA

Analog inputs

Input current

Continuous

10 mA

Analog inputs

Input voltage

VDD + 0.5 V to GND − 0.5 V

Operating free-air temperature range, TA

−40

°C to 85°C

Storage temperature range, TSTG

−65

°C to 150°C

Junction temperature (TJ max)

150

°C

Lead temperature, soldering (10 sec)

300

°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.