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CY8C20336H Datasheet(PDF) 10 Page - Cypress Semiconductor |
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CY8C20336H Datasheet(HTML) 10 Page - Cypress Semiconductor |
10 / 35 page CY8C20336H, CY8C20446H Document Number: 001-56223 Rev. *D Page 10 of 35 48-Pin QFN OCD The 48-pin QFN part is for the CY8C20066A On-Chip Debug (OCD) PSoC device. Note that this part is only used for in-circuit debugging.[9] Table 3. Pin Definitions - CY8C20066A PSoC Device [10, 11] Pin No. Name Description Figure 4. CY8C20066A PSoC Device 1 OCDOE OCD mode direction pin 2 I/O I P2[7] 3 I/O I P2[5] Crystal output (XOut) 4 I/O I P2[3] Crystal input (XIn) 5 I/O I P2[1] 6 I/O I P4[3] 7 I/O IP4[1] 8 I/O I P3[7] 9 I/O I P3[5] 10 I/O I P3[3] 11 I/O I P3[1] 12 IOHR I P1[7] I2C SCL, SPI SS 13 IOHR I P1[5] I2C SDA, SPI MISO 14 CCLK OCD CPU clock output 15 HCLK OCD high speed clock output 16 IOHR I P1[3] SPI CLK. 17 IOHR I P1[1] ISSP CLK[12], I2C SCL, SPI MOSI 18 Power Vss Ground connection 19 I/O D+ USB D+ 20 I/O D- USB D- 21 Power VDD Supply voltage 22 IOHR I P1[0] ISSP DATA(12), I2C SDA, SPI CLK 23 IOHR I P1[2] Pin No. Name Description 24 IOHR I P1[4] Optional external clock input (EXTCLK) 37 IOH I P0[0] 25 IOHR I P1[6] 38 IOH I P0[2] 26 Input XRES Active high external reset with internal pull down 39 IOH I P0[4] 27 I/O I P3[0] 40 IOH I P0[6] 28 I/O IP3[2] 41 Power VDD Supply voltage 29 I/O IP3[4] 42 OCDO OCD even data I/O 30 I/O IP3[6] 43 OCDE OCD odd data output 31 I/O I P4[0] 44 IOH I P0[7] 32 I/O I P4[2] 45 IOH I P0[5] 33 I/O I P2[0] 46 IOH I P0[3] Integrating input 34 I/O I P2[2] 47 Power VSS Ground connection 35 I/O I P2[4] 48 IOH I P0[1] 36 I/O I P2[6] CP Power VSS Center pad must be connected to ground LEGEND A = Analog, I = Input, O = Output, NC = No Connection H = 5 mA High Output Drive, R = Regulated Output. Notes 9. This part is available in limited quantities for In-Circuit Debugging during prototype development. It is not available in production volumes. 10. During power-up or reset event, device P1[1] and P1[0] may disturb the I2C bus. Use alternate pins if you encounter any issues. 11. The center pad (CP) on the QFN package must be connected to ground (Vss) for best mechanical, thermal, and electrical performance. If not connected to ground, it must be electrically floated and not connected to any other signal. 12. These are the ISSP pins, which are not High Z at power on reset (POR). QFN (Top View) 10 11 12 AI, P2[7] AI, XOut, P2[5] AI, XIn , P2[3] AI , P2[1] AI , P4[3] AI , P4[1] AI , P3[7] AI , P3[5] AI , P3[3] AI , P3[1] AI, I2 C SCL, SPI SS, P1[7] 35 34 33 32 31 30 29 28 27 26 25 36 P2[4] ,AI P2[2] ,AI P2[0] ,AI P4[2] ,AI P4[0] ,AI P3[6] ,AI P3[4] , AI P3[2] ,AI P3[0] , AI XRES P1[6] , AI P2[6] ,AI 1 2 3 4 5 6 7 8 9 OCDOE |
Similar Part No. - CY8C20336H_12 |
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Similar Description - CY8C20336H_12 |
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