CY7C2570XV18-600BZXC datasheet(8/29 Pages) CYPRESS

Part #	CY7C2570XV18-600BZXC

Description	72-Mbit DDR II Xtreme SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency) with ODT

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Manufacturer	CYPRESS [Cypress Semiconductor]

Direct Link	http://www.cypress.com

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8 / 29 page

CY7C2568XV18, CY7C2570XV18

Document Number: 001-70206 Rev. *B

Page 8 of 29

DDR II+. CQ is referenced with respect to K and CQ is

referenced with respect to K. These are free-running clocks and

are synchronized to the input clock of the DDR II+. The timing for

the echo clocks is shown in the Switching Characteristics on

page 23.

Valid Data Indicator (QVLD)

QVLD is provided on the DDR II+ to simplify data capture on high

speed systems. The QVLD is generated by the DDR II+ device

along with data output. This signal is also edge aligned with the

echo clock and follows the timing of any data pin. This signal is

asserted half a cycle before valid data arrives.

On-Die Termination (ODT)

These devices have an On-Die Termination feature for Data

inputs (D[x:0]), Byte Write Selects (BWS[x:0]), and Input Clocks (K

and K). The termination resistors are integrated within the chip.

The ODT range selection is enabled through ball R6 (ODT pin).

The ODT termination tracks value of RQ where RQ is the resistor

tied to the ZQ pin. ODT range selection is made during power up

initialization. A LOW on this pin selects a low range that follows

RQ/3.33 for 175

< RQ < 350 (where RQ is the resistor tied

to ZQ pin)

A HIGH on this pin selects a high range that follows

RQ/1.66 for 175

< RQ < 250 (where RQ is the resistor tied

to ZQ pin). When left floating, a high range termination value is

selected by default. For a detailed description on the ODT

implementation, refer to the application note, On-Die Termination

for QDRII+/DDRII+ SRAMs.

PLL

These chips use a PLL that is designed to function between

120 MHz and the specified maximum clock frequency. During

power up, when the DOFF is tied HIGH, the PLL is locked after

100

s of stable clock. The PLL can also be reset by slowing or

stopping the input clock K and K for a minimum of 30 ns.

However, it is not necessary to reset the PLL to lock to the

desired frequency. The PLL automatically locks 100

s after a

stable clock is presented. The PLL may be disabled by applying

ground to the DOFF pin. When the PLL is turned off, the device

behaves in DDR I mode (with one cycle latency and a longer

access time). For information, refer to the application note, PLL

Considerations in QDRII/DDRII/QDRII+/DDRII+.

Application Example

Figure 2 shows two DDR II+ used in an application.

Figure 2. Application Example

DQ

A

SRAM#2

LD

CQ/CQ

K

ZQ

K

ODT

R/W BWS

BUS

MASTER

(CPU or ASIC)

DQ

Addresses

LD

R/W

R = 250ohms

Source CLK

Echo Clock1/Echo Clock1

Echo Clock2/Echo Clock2

ODT

R = 250ohms

BWS

DQ

A

SRAM#1

LD

K

ZQ

CQ/CQ

K

ODT

R/W BWS

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