2

DS1339A

Voltage Range on Any Pin Relative to Ground....-0.3V to +6.0V

Operating Temperature Range (Noncondensing)....-40NC to +85NC

Storage Temperature Range............................ -55NC to +125NC

Lead Temperature (soldering, 10 seconds) ...................+300NC

Soldering Temperature (reflow) ......................................+260NC

µSOP

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-

tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PACKAGE THERMAL CHARACTERISTICS (Note 1)

RECOMMENDED OPERATING CONDITIONS

DC ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Supply Voltage

1.71

3.3

5.5

V

Backup Supply Voltage

1.3

3.0

3.7

V

1.15

1.3

Logic 1

0.7 x

5.5

V

Logic 0

-0.3

0.3 x

V

Power-Fail Voltage

1.51

1.61

1.71

V

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Input Leakage

(Note 3)

-0.1

0.1

F

A

I/O Leakage

(Note 4)

-0.1

0.1

F

A

Logic 0 Out (SDA or SQW/INT)

(Note 4)

3

mA

Logic 0 Out (SQW/INT)

(Note 4)

250

F

A

(Note 5)

450

F

A

(Note 6)

200

F

A

Trickle-Charger Resistor Register

R1

(Note 7)

200

I