DS28E15

1-Wire SHA-256 Secure Authenticator

with 512-Bit User EEPROM

4

ABRIDGED DATA SHEET

ELECTRICAL CHARACTERISTICS (continued)

Note 24: EEPROM writes can become nonfunctional after the data-retention time is exceeded. Long-term storage at elevated tem-

peratures is not recommended.

Note 25: Refer to the full data sheet.

Pin Configurations

Pin Descriptions

PIN

NAME

FUNCTION

SFN

TDFN-EP

TSOC

—

1, 4, 5, 6

3– 6

N.C.

Not Connected

1

2

2

IO

1-Wire Bus Interface. Open-drain signal that requires an external pullup resistor.

2

3

1

GND

Ground Reference

—

—

—

EP

Exposed Pad (TDFN Only). Solder evenly to the board’s ground plane for proper

operation. Refer to Application Note 3273: Exposed Pads: A Brief Introduction for

additional information.

TOP VIEW

N.C.

IO

GND

N.C.

N.C.

N.C.

TSOC

+

5

4

6

2

3

1

DS28E15

BOTTOM VIEW

NOTE: THE SFN PACKAGE IS QUALIFIED FOR ELECTRO-

MECHANICAL CONTACT APPLICATIONS ONLY, NOT FOR

SOLDERING. FOR MORE INFORMATION, REFER TO

APPLICATION NOTE 4132: ATTACHMENT METHODS FOR

THE ELECTRO-MECHANICAL SFN PACKAGE.

16

N.C.

N.C.

25

IO

N.C.

34

GND

N.C.

TDFN-EP

(3mm × 3mm)

TOP VIEW

DS28E15

+

*EP

*EXPOSED PAD

1

2

IO

GND

DS2431GA

SFN