Rev. 11/21/00

SPX2955/56/57

(Continued)

PARAMETER

CONDITIONS

(Note 2)

Typ.

SPX2955/57A

Min

Max

SPX2955/57

Min

Max

UNITS

Adjustable Versions only

Typ.

SPX2955/57A

SPX2955/57B

Reference Voltage

1.235

1.210

1.200

1.260

1.270

1.200

1.990

1.270

1.280

V

Reference Voltage

Over Temperature (Note 6)

1.185

1.285

1.185

1.285

V

Feedback Pin Bias Current

20

40

60

60

80

NA

Reference Voltage Temperature

Coefficient

(Note 7)

50

ppm/°C

Feedback Pin Bias Current

Temperature Coefficient

0.1

nA/°C

Error Comparator

Output Leakage Current

0.01

1.00

2.00

1.00

2.00

µA

Output Low Voltage

µA

150

250

400

250

400

mV

Upper Threshold Voltage

(Note 8)

60

40

25

40

25

mV

Lower Threshold Voltage

(Note 8)

75

95

140

95

140

mV

Hysteresis

(Note 8)

15

mV

Shutdown Input

Input logic Voltage

Low (Regulator ON)

High (Regulator OFF)

1.3

2.0

0.7

2.0

0.7

V

Shut down Pin Input Current

30

450

50

100

600

750

90

150

800

1000

µA

Regulator Output Current in Shutdown

3

10

20

15

25

µA

Note 1: Output or reference voltage temperature coefficients defined as the worst case voltage change divided by the total temperature range.

≤ 0.8V.

Note 3: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are

covered under the specification for thermal regulation.

Note 4: Line regulation for the SPX2955/56/57 is tested at 150

typical performance characteristics for line regulation versus temperature and load current.

Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 100 mV below its nominal value measured at 1V differential at

very low values of programmed output voltage, the minimum input supply voltage of 2V ( 2.3V over temperature) must be taken into account.

Note 7: Comparator thresholds are expressed in terms of a voltage differential at the feedback terminal below the nominal reference voltage measured at 6V input. To

Note 9: The junction -to-ambient thermal resistance of the TO-92 package is 180

°C/ W with 0.4” leads and 160°C/ W with 0.25” leads to a PC board.

The thermal resistance of the 8-Pin DIP package is 105

°C/W junction-to-ambient when soldered directly to a PC board. Junction-to-ambient thermal resistance for the

SOIC (S) package is 160

°C/W.