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MC33984CHFK Datasheet(PDF) 7 Page - Freescale Semiconductor, Inc |
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MC33984CHFK Datasheet(HTML) 7 Page - Freescale Semiconductor, Inc |
7 / 38 page Analog Integrated Circuit Device Data Freescale Semiconductor 7 33984 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS THERMAL RATINGS Operating Temperature Ambient Junction TA TJ -40 to 125 -40 to 150 °C Storage Temperature TSTG -55 to 150 °C Thermal Resistance(5) Junction-to-Case Junction-to-Ambient RθJC RθJA <1.0 30 °C/W Peak Package Reflow Temperature During Reflow(6), (7) TPPRT Note 7 °C Notes 5. Device mounted on a 2s2p test board according to JEDEC JESD51-2. 6. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. 7. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020. For Peak Package Reflow Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics. Table 3. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Rating Symbol Value Unit |
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