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MCIMX503CVK8B Datasheet(PDF) 22 Page - Freescale Semiconductor, Inc |
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MCIMX503CVK8B Datasheet(HTML) 22 Page - Freescale Semiconductor, Inc |
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22 / 134 page  i.MX50 Applications Processors for Consumer Products, Rev. 2 22 Freescale Semiconductor Electrical Characteristics 4.1.2 Thermal Resistance Data 4.1.2.1 13 x 13 mm MAPBGA Package Thermal Resistance Data Table 8 provides thermal resistance data for a 13 x 13 mm MAPBGA package. ESD damage immunity: Vesd V Human Body Model (HBM) Charge Device Model (CDM) — — 2000 500 Storage temperature range TSTORAGE –40 125 oC 1 The term OVDD in this section refers to the associated supply rail of an input or output. The maximum range can be superseded by the DC tables. Table 8. 13 x 13 mm MAPBGA Package Thermal Resistance Data Rating Board Symbol Value Unit Junction to Ambient (natural convection)1, 2 1 Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance. 2 Per JEDEC JESD51-2 with the single layer board horizontal. The thermal test board meets JESD51-9 specification. Single layer board (1s) RθJA 51 °C/W Junction to Ambient (natural convection)1, 2, 3 3 Per JEDEC JESD51-6 with the board horizontal. Four layer board (2s2p) RθJA 28 °C/W Junction to Ambient (at 200 ft/min)1, 3 Single layer board (1s) RθJMA 40 °C/W Junction to Ambient (at 200 ft/min)1, 3 Four layer board (2s2p) RθJMA 24 °C/W Junction to Board4 4 Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on the top surface of the board near the package. — RθJB 14 °C/W Junction to Case5 5 Thermal resistance between the die and the case top surface as measured by using the cold plate method (MIL SPEC-883 Method 1012.1). — RθJC 9°C/W Junction to Package Top (natural convection)6 6 Thermal characterization parameter indicating the temperature difference between the package top and the junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT. — Ψ JT 2°C/W Table 7. Absolute Maximum Ratings (continued) Parameter Description Symbol Min Max Unit |
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