SP4428DS/16

SP4428 Electroluminescent Lamp Driver

© Copyright 2000 Sipex Corporation

8

Figure 5. Bonding Diagram

D

A

PN

I

PX

Y

N

O

H8

5

.

2

2

8

-5

.

3

9

3

V

D

D

70

.

5

0

25

.

8

1

4

1

L

E6

0

.

6

9

75

.

9

4

3

2

L

E5

5

.

0

7

85

.

9

1

P

A

C4

5

.

0

7

85

.

9

8

1

-

L

I

O

C3

5

.

5

8

75

.

9

8

3

-

V

S

S

25

.

5

7

15

.

0

2

4

-

C

C

S

O

10

.

8

4

8

-0

.

6

0

1

-

NOTES:

1. Dimensions are in Microns unless otherwise noted.

2. Bonding pads are 125 X 125 typical.

3. Outside dimensions are maximum, including scribe area.

4. Die thickness is 380

± 25 microns.

5. Pad center coordinates are relative to die center.

6. Die size (step size): 81 X 46 mils

BONDING DIAGRAM

EL1

CAP

C

OSC

COIL

EL2

V

DD

HON

V

SS

X

Y