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RF-35A2 Datasheet(PDF) 3 Page - Freescale Semiconductor, Inc |
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RF-35A2 Datasheet(HTML) 3 Page - Freescale Semiconductor, Inc |
3 / 17 page MD7IC2251NR1 MD7IC2251GNR1 3 RF Device Data Freescale Semiconductor, Inc. Table 5. Electrical Characteristics (TA =25°C unless otherwise noted) (continued) Characteristic Symbol Min Typ Max Unit Stage 2 -- Off Characteristics (1) Zero Gate Voltage Drain Leakage Current (VDS =65 Vdc, VGS =0 Vdc) IDSS — — 10 μAdc Zero Gate Voltage Drain Leakage Current (VDS =28 Vdc, VGS =0 Vdc) IDSS — — 1 μAdc Gate--Source Leakage Current (VGS =1.5 Vdc, VDS =0 Vdc) IGSS — — 1 μAdc Stage 2 -- On Characteristics (1) Gate Threshold Voltage (VDS =10 Vdc, ID = 150 μAdc) VGS(th) 1.2 2.0 2.7 Vdc Gate Quiescent Voltage (VDS =28 Vdc, IDQ2A = 260 mAdc) VGSA(Q) — 2.7 — Vdc Fixture Gate Quiescent Voltage (VDD =28 Vdc, IDQ2A = 260 mAdc, Measured in Functional Test) VGGA(Q) 5.5 6.3 7.5 Vdc Drain--Source On--Voltage (VGS =10 Vdc, ID =1 Adc) VDS(on) 0.1 0.24 1.2 Vdc Functional Tests (2,3,4) (In Freescale Doherty Production Test Fixture, 50 ohm system) VDD =28 Vdc, IDQ1(A+B) =80 mA, IDQ2A = 260 mA, VGS2B =1.4 Vdc, Pout = 12 W Avg., f = 2140 MHz, Single--Carrier W--CDMA, IQ Magnitude Clipping, Input Signal PAR = 9.9 dB @ 0.01% Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @ ±5MHz Offset. Power Gain Gps 27.6 28.2 32.0 dB Power Added Efficiency PAE 33.5 36.9 — % Output Peak--to--Average Ratio @ 0.01% Probability on CCDF PAR 6.2 6.6 — dB Adjacent Channel Power Ratio ACPR — --34.2 --31.5 dBc Typical Broadband Performance (In Freescale Doherty Characterization Test Fixture, 50 ohm system) VDD =28 Vdc, IDQ1(A+B) =80 mA, IDQ2A = 260 mA, VGS2B =1.4 Vdc, Pout = 12 W Avg., Single--Carrier W--CDMA, IQ Magnitude Clipping, Input Signal PAR = 9.9 dB @ 0.01% Probability on CCDF. ACPR measured in 3.84 MHz Channel Bandwidth @ ±5MHz Offset. Frequency Gps (dB) PAE (%) Output PAR (dB) ACPR (dBc) 2110 MHz 28.8 38.2 7.1 --34.6 2140 MHz 29.0 37.9 7.1 --36.2 2170 MHz 29.2 37.4 6.9 --36.1 1. Each side of device measured separately. 2. Part internally matched both on input and output. 3. Measurement made with device in a Symmetrical Doherty configuration. 4. Measurement made with device in straight lead configuration before any lead forming operation is applied. (continued) |
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