MCM6926A

2

MOTOROLA FAST SRAM

E

G

W

Mode

VDD Current

Output

Cycle

H

X

X

Not Selected

ISB1, ISB2

High–Z

—

L

H

H

Output Disabled

IDDA

High–Z

—

L

L

H

Read

IDDA

Dout

Read Cycle

L

X

L

Write

IDDA

High–Z

Write Cycle

Rating

Symbol

Value

Unit

Power Supply Voltage

VDD

– 0.5 to + 4.6

V

Voltage Relative to VSS for Any Pin

Except VDD

Vin, Vout

– 0.5 to VDD + 0.5

V

Output Current

Iout

± 30

mA

Power Dissipation

PD

0.6

W

Temperature Under Bias

Tbias

– 10 to + 85

°C

Operating Temperature

TA

0 to + 70

°C

Storage Temperature — Plastic

Tstg

– 55 to + 125

°C

NOTE: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are

exceeded. Functional operation should be restricted to RECOMMENDED OPER-

ATING CONDITIONS. Exposure to higher than recommended voltages for

extended periods of time could affect device reliability.

DC OPERATING CONDITIONS AND CHARACTERISTICS

(VDD = 3.3 V + 10%, – 5%, TA = 0 to 70°C, Unless Otherwise Noted)

RECOMMENDED OPERATING CONDITIONS

Parameter

Symbol

Min

Typ

Max

Unit

Supply Voltage (Operating Voltage Range)

VDD

3.135

3.3

3.6

V

Input High Voltage

VIH

2.2

—

V

Input Low Voltage

VIL

– 0.5

*

—

0.8

V

*VIL (min) = – 0.5 V dc; VIL (min) = – 2.0 V ac (pulse width ≤ 2.0 ns) for I ≤ 20.0 mA.

** VIH (max) = VDD + 0.3 V dc; VIH (max) = VDD + 2 V ac (pulse width ≤ 2.0 ns) for I ≤ 20.0 mA.

DC CHARACTERISTICS

Parameter

Symbol

Min

Max

Unit

Input Leakage Current (All Inputs, Vin = 0 to VDD)

Ilkg(I)

—

± 1.0

µA

Output Leakage Current (E = VIH, Vout = 0 to VDD)

Ilkg(O)

—

± 1.0

µA

Output Low Voltage (IOL = + 8.0 mA)

VOL

—

0.4

V

Output High Voltage (IOH = – 4.0 mA)

VOH

2.4

—

V

This device contains circuitry to protect the

inputs against damage due to high static volt-

ages or electric fields; however, it is advised

that normal precautions be taken to avoid

application of any voltage higher than maxi-

mum rated voltages to these high–impedance

circuits.

This BiCMOS memory circuit has been de-

signed to meet the dc and ac specifications

shown in the tables, after thermal equilibrium

has been established. The circuit is in a test

socket or mounted on a printed circuit board

and transverse air flow of at least 500 linear feet

per minute is maintained.