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EN25S32-104RIP Datasheet(PDF) 11 Page - Eon Silicon Solution Inc.

Part # EN25S32-104RIP
Description  32 Megabit 1.8V Serial Flash Memory with 4Kbyte Uniform Sector
Download  59 Pages
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Manufacturer  EON [Eon Silicon Solution Inc.]
Direct Link  http://www.essi.com.tw
Logo EON - Eon Silicon Solution Inc.

EN25S32-104RIP Datasheet(HTML) 11 Page - Eon Silicon Solution Inc.

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This Data Sheet may be revised by subsequent versions
©2004 Eon Silicon Solution, Inc.,
www.eonssi.com
or modifications due to changes in technical specifications.
11
EN25S32
Rev. J, Issue Date: 2012/01/19
Table 3. Protected Area Sizes Sector Organization
Status Register Content
Memory Content
BP3
Bit
BP2
Bit
BP1
Bit
BP0
Bit
Protect Areas
Addresses
Density(KB)
Portion
0
0
0
0
None
None
None
None
0
0
0
1
Block 0 to 62
000000h-3EFFFFh
4032KB
Lower 63/64
0
0
1
0
Block 0 to 61
000000h-3DFFFFh 3968KB
Lower 62/64
0
0
1
1
Block 0 to 59
000000h-3BFFFFh
3840KB
Lower 60/64
0
1
0
0
Block 0 to 55
000000h-37FFFFh
3584KB
Lower 56/64
0
1
0
1
Block 0 to 47
000000h-2FFFFFh
3072KB
Lower 48/64
0
1
1
0
Block 0 to 31
000000h-1FFFFFh
2048KB
Lower 32/64
0
1
1
1
All
000000h-3FFFFFh
4096KB
All
1
0
0
0
None
None
None
None
1
0
0
1
Block 63 to 1
3FFFFFh-010000h
4032KB
Upper 63/64
1
0
1
0
Block 63 to 2
3FFFFFh-020000h
3968KB
Upper 62/64
1
0
1
1
Block 63 to 4
3FFFFFh-040000h
3840KB
Upper 60/64
1
1
0
0
Block 63 to 8
3FFFFFh-080000h
3584KB
Upper 56/64
1
1
0
1
Block 63 to 16
3FFFFFh-100000h
3072KB
Upper 48/64
1
1
1
0
Block 63 to 32
3FFFFFh-200000h
2048KB
Upper 32/64
1
1
1
1
All
000000h-3FFFFFh
4096KB
All
INSTRUCTIONS
All instructions, addresses and data are shifted in and out of the device, most significant bit first. Serial
Data Input (DI) is sampled on the first rising edge of Serial Clock (CLK) after Chip Select (CS#) is
driven Low. Then, the one-byte instruction code must be shifted in to the device, most significant bit first,
on Serial Data Input (DI), each bit being latched on the rising edges of Serial Clock (CLK).
The instruction set is listed in Table 4. Every instruction sequence starts with a one-byte instruction
code. Depending on the instruction, this might be followed by address bytes, or by data bytes, or by
both or none. Chip Select (CS#) must be driven High after the last bit of the instruction sequence has
been shifted in. In the case of a Read Data Bytes (READ), Read Data Bytes at Higher Speed
(Fast_Read), Dual Output Fast Read (3Bh), Dual I/O Fast Read (BBh), Quad Input/Output
FAST_READ (EBh), Read Status Register (RDSR), Read Suspend Status Register (RDSSR) or
Release from Deep Power-down, and Read Device ID (RDI) instruction, the shifted-in instruction se-
quence is followed by a data-out sequence. Chip Select (CS#) can be driven High after any bit of the
data-out sequence is being shifted out.
In the case of a Page Program (PP), Sector Erase (SE), Block Erase (BE), Chip Erase (CE), Write
Status Register (WRSR), Write Enable (WREN), Write Disable (WRDI) or Deep Power-down (DP)
instruction, Chip Select (CS#) must be driven High exactly at a byte boundary, otherwise the instruction
is rejected, and is not executed. That is, Chip Select (CS#) must driven High when the number of clock
pulses after Chip Select (CS#) being driven Low is an exact multiple of eight. For Page Program, if at
any time the input byte is not a full byte, nothing will happen and WEL will not be reset.
In the case of multi-byte commands of Page Program (PP), and Release from Deep Power Down
(RES ) minimum number of bytes specified has to be given, without which, the command will be
ignored.
In the case of Page Program, if the number of byte after the command is less than 4 (at least 1
data byte), it will be ignored too. In the case of SE and BE, exact 24-bit address is a must, any
less or more will cause the command to be ignored.
All attempts to access the memory array during a Write Status Register cycle, Program cycle or Erase
cycle are ignored, and the internal Write Status Register cycle, Program cycle or Erase cycle continues
unaffected.


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