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LTC3250-1.5 Datasheet(PDF) 9 Page - Linear Technology |
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LTC3250-1.5 Datasheet(HTML) 9 Page - Linear Technology |
9 / 12 page LTC3261 9 3261f APPLICATIONS INFORMATION should be consulted to ensure the desired capacitance at all temperatures and voltages. Table 1 is a list of ceramic capacitor manufacturers and their websites. Table 1 AVX www.avxcorp.com Kemet www.kemet.com Murata www.murata.com Taiyo Yuden www.t-yuden.com Vishay www.vishay.com TDK www.component.tdk.com Layout Considerations Due to high switching frequency and high transient currents produced by LTC3261, careful board layout is necessary for optimum performance. A true ground plane and short connections to all the external capacitors will improve performance and ensure proper regulation under all condi- tions. Figure 3 shows an example layout for the LTC3261. The flying capacitor nodes C+ and C– switch large currents at a high frequency. These nodes should not be routed close to sensitive pins such as the RT pin . Thermal Management At high input voltages and maximum output current, there can be substantial power dissipation in the LTC3261. If the junction temperature increases above approximately 175°C, the thermal shutdown circuitry will automatically deactivate the output. To reduce the maximum junction temperature, a good thermal connection to the PC board groundplaneisrecommended.Connectingtheexposedpad of the package to a ground plane under the device on two layers of the PC board can reduce the thermal resistance of the package and PC board considerably. Derating Power at High Temperatures To prevent an overtemperature condition in high power applications, Figure 4 should be used to determine the maximum combination of ambient temperature and power dissipation. The power dissipated in the LTC3261 should always fall under the line shown for a given ambient temperature. The power dissipated in the LTC3261 is: PD = (VIN – |VOUT|) • (IOUT) where IOUT denotes output current at the VOUT pin. The derating curve in Figure 4 assumes a maximum thermal resistance, θJA, of 40°C/W for the package. This can be achieved from a printed circuit board layout with a solid ground plane and a good connection to the exposed pad of the LTC3261 package. It is recommended that the LTC3261 be operated in the region corresponding to TJ ≤ 150°C for continuous opera- tion as shown in Figure 4. Short-term operation may be acceptable for 150°C < TJ < 175°C but long-term operation in this region should be avoided as it may reduce the life of the part or cause degraded performance. For TJ > 175°C the part will be in thermal shutdown. Figure 3. Recommended Layout Figure 4. Maximum Power Dissipation vs Ambient Temperature AMBIENT TEMPERATURE (°C) –50 0 6 4 5 2 3 1 75 50 25 0 125 100 –25 175 150 3261 F04 θJA = 40°C/W THERMAL SHUTDOWN RECOMMENDED OPERATION TJ = 150°C TJ = 175°C GND GND 3261 F03 CFLY RT VIN VOUT EN MODE |
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